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MX29GL512FUXFI-11G

MX29GL512FUXFI-11G

MX29GL512FUXFI-11G

Macronix

Memory IC 13mm mm

SOT-23

MX29GL512FUXFI-11G Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Surface Mount YES
JESD-609 Code e1
Number of Terminations 64
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code R-PBGA-B64
Supply Voltage-Max (Vsup) 3.6V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7V
Interface Parallel
Memory Type FLASH, NOR
Operating Mode ASYNCHRONOUS
Organization 32MX16
Memory Width 16
Memory Density 536870912 bit
Access Time (Max) 110 ns
Programming Voltage 3V
Alternate Memory Width 8
Length 13mm
Height Seated (Max) 1.4mm
Width 11mm
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
MX29GL512FUXFI-11G Product Details

MX29GL512FUXFI-11G Overview


Its memory type can be classified as FLASH, NOR. 64 terminations are planted on the chip. This part supports as many as 1 functions for the comprehensive working procedure. This ic memory chip is designed to be supplied with 3V. The minimum operating temperature of this device must not be less than -40°C. It is recommended for operation at temperatures no higher than. To alter the state of certain nonvolatile memory arrays, 3V programming voltage is required.

MX29GL512FUXFI-11G Features




MX29GL512FUXFI-11G Applications


There are a lot of Macronix
MX29GL512FUXFI-11G Memory applications.


  • Cache memory
  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications

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