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MX29GL640EBTI-70Q

MX29GL640EBTI-70Q

MX29GL640EBTI-70Q

Macronix

MX29GL Memory IC MX29GL Series

SOT-23

MX29GL640EBTI-70Q Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Supplier Device Package 48-TSOP
Operating Temperature -40°C~85°C TA
Packaging Tray
Series MX29GL
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Interface Parallel
Memory Size 64Mb 8M x 8
Memory Type Non-Volatile
Access Time 70ns
Memory Format FLASH
Memory Interface Parallel
Write Cycle Time - Word, Page 70ns
RoHS Status ROHS3 Compliant
MX29GL640EBTI-70Q Product Details

MX29GL640EBTI-70Q Overview


A Non-Volatile-type memory can be classified as the memory type of this device. It comes in a Tray. In the case of 48-TFSOP (0.724, 18.40mm Width), it is embedded within the case. There is 64Mb 8M x 8 of memory on the chip. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. A supply voltage of 2.7V~3.6V can be applied to it. Its recommended mounting type is Surface Mount. Its target applications rely heavily on the MX29GL series memory devices. Memory ics must operate at a temperature of at least -40°C. The part should not be operated at temperatures above 85°C degrees Celsius as otherwise, the part may be damaged due to the excessive amount of heat.

MX29GL640EBTI-70Q Features


Package / Case: 48-TFSOP (0.724, 18.40mm Width)

MX29GL640EBTI-70Q Applications


There are a lot of Macronix MX29GL640EBTI-70Q Memory applications.

  • main computer memory
  • personal digital assistants
  • data buffer
  • printers
  • Cache memory
  • eDRAM
  • multimedia computers
  • networking
  • hard disk drive (HDD)
  • telecommunications

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