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5962F1120102VXA

5962F1120102VXA

5962F1120102VXA

Cypress Semiconductor

Memory IC 25mm mm

SOT-23

5962F1120102VXA Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Surface Mount YES
Number of Terminations 165
ECCN Code 9A515.E
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Technology CMOS
Terminal Position BOTTOM
Terminal Form UNSPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-CBGA-X165
Qualification Status Qualified
Operating Temperature (Max) 125°C
Operating Temperature (Min) -55°C
Supply Voltage-Max (Vsup) 1.9V
Temperature Grade MILITARY
Supply Voltage-Min (Vsup) 1.7V
Operating Mode SYNCHRONOUS
Organization 4MX18
Memory Width 18
Memory Density 75497472 bit
Parallel/Serial PARALLEL
Memory IC Type QDR SRAM
Total Dose 300k Rad(Si) V
Length 25mm
Height Seated (Max) 5.38mm
Width 21mm
RoHS Status Non-RoHS Compliant
5962F1120102VXA Product Details

5962F1120102VXA Overview


A total of 165 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 1.8V will be necessary. This chip features all the merits of a conventional chip, but it also features PIPELINED ARCHITECTURE to improve system performance. This chip contains a QDR SRAM type of memory IC. Use it only at temperatures above 125°C. A temperature of -55°C is required for the unit to operate, otherwise, it will not operate.

5962F1120102VXA Features


Additional Feature:PIPELINED ARCHITECTURE


5962F1120102VXA Applications


There are a lot of Cypress Semiconductor
5962F1120102VXA Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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