CYFB0072V18L-133BGXI

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Manufacturer part number:CYFB0072V18L-133BGXI

Manufacturer:Cypress Semiconductor Corp

Description:CYFB0072V18L-133BGXI datasheet pdf and Unclassified product details from Cypress Semiconductor Corp stock available on our website

Case Package:SOT-23

Datasheet:CYFB0072V18L-133BGXI Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Contact Plating	Copper, Silver, Tin
Mount	Surface Mount
Package / Case	FBGA
Published	2011
JESD-609 Code	e1
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	209
ECCN Code	EAR99
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature	85°C
Min Operating Temperature	-40°C
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	1.5V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	30
Pin Count	209
Operating Supply Voltage	1.8V
Temperature Grade	INDUSTRIAL
Number of Circuits	2
Max Supply Voltage	1.9V
Min Supply Voltage	1.7V
Memory Size	9MB
Element Configuration	Dual
Max Supply Current	600mA
Access Time	10 ns
Data Bus Width	36b
Memory Width	36
Density	72 Mb
Max Frequency	133MHz
Memory IC Type	MEMORY CIRCUIT
Bus Directional	Unidirectional
Retransmit Capability	No
Height Seated (Max)	1.96mm
RoHS Status	ROHS3 Compliant