24KB 24K x 8 Mask ROM F2MC-8L 8-Bit Microcontroller F2MC-8L MB89630R Series 64-BQFP
SOT-23
MB89636RPF-G-1315-BNDE1 Datasheet
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In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
26 Weeks
Mounting Type
Surface Mount
Package / Case
64-BQFP
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
F2MC-8L MB89630R
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Oscillator Type
External
Number of I/O
53
Speed
10MHz
RAM Size
768 x 8
Voltage - Supply (Vcc/Vdd)
2.2V~6V
Core Processor
F2MC-8L
Peripherals
POR, PWM, WDT
Program Memory Type
Mask ROM
Core Size
8-Bit
Program Memory Size
24KB 24K x 8
Connectivity
EBI/EMI, Serial I/O, UART/USART
Data Converter
A/D 8x10b
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
66
$19.50000
$1287
MB89636RPF-G-1315-BNDE1 Product Details
MB89636RPF-G-1315-BNDE1 Overview
The package is 64-BQFP-shaped. There are 53 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 8-Bit core architecture. The type of program memory it uses is Mask ROM. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the F2MC-8L MB89630R series of electrical components. Having a size of 24KB 24K x 8, Microcontroller has a program memory of X bytes. A F2MC-8L Core Processor is at the core of this Microcontroller.
MB89636RPF-G-1315-BNDE1 Features
64-BQFP package Mounting type of Surface Mount
MB89636RPF-G-1315-BNDE1 Applications
There are a lot of Cypress Semiconductor Corp MB89636RPF-G-1315-BNDE1 Microcontroller applications.