32KB 32K x 8 Mask ROM F2MC-8L 8-Bit Microcontroller F2MC-8L MB89630R Series 64 Pin 10MHz 64-BQFP
SOT-23
MB89637RPF-G-674-BNDE1 Datasheet
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
64-BQFP
Number of Pins
64
Supplier Device Package
64-QFP (14x20)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
F2MC-8L MB89630R
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Frequency
10MHz
Interface
EBI/EMI, Serial, UART, USART
Memory Size
32kB
Oscillator Type
External
Number of I/O
53
Speed
10MHz
RAM Size
1K x 8
Memory Type
Mask ROM
Voltage - Supply (Vcc/Vdd)
2.2V~6V
Core Processor
F2MC-8L
Peripherals
POR, PWM, WDT
Program Memory Type
Mask ROM
Core Size
8-Bit
Program Memory Size
32KB 32K x 8
Connectivity
EBI/EMI, Serial I/O, UART/USART
Data Converter
A/D 8x10b
RoHS Status
ROHS3 Compliant
MB89637RPF-G-674-BNDE1 Product Details
MB89637RPF-G-674-BNDE1 Overview
There is a 64-BQFP package available. The board has 53 I/Os. Using the Mounting Type Surface Mount, the MCU is mounted on PCB. A 8-Bit core is used in order to power the IC chip. The type of memory it uses for its program is Mask ROM. -40°C~85°C TA is the temperature range at which this Microcontroller operates. F2MC-8L MB89630R-series components are electrical components. In the case of this Microcontroller, the memory size of the program is 32KB 32K x 8. Powered by a F2MC-8L Core processor. This IC part has a memory size of 32kB. Performing well when operated at frequency 10MHz can be achieved. On the chip, there are 64 pins that can be accessed. Mask ROM memory is one of the features of this equipment.
MB89637RPF-G-674-BNDE1 Features
64-BQFP package Mounting type of Surface Mount Minimum temperature of -40°C
MB89637RPF-G-674-BNDE1 Applications
There are a lot of Cypress Semiconductor Corp MB89637RPF-G-674-BNDE1 Microcontroller applications.