32KB 32K x 8 Mask ROM F2MC-8L 8-Bit Microcontroller F2MC-8L MB89630R Series 64 Pin 10MHz 64-BQFP
SOT-23
MB89637RPFR-G-1370-BND Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
64-BQFP
Number of Pins
64
Supplier Device Package
64-QFP (14x20)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
F2MC-8L MB89630R
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Frequency
10MHz
Interface
EBI/EMI, Serial, UART, USART
Memory Size
32kB
Oscillator Type
External
Number of I/O
53
Speed
10MHz
RAM Size
1K x 8
Memory Type
Mask ROM
Voltage - Supply (Vcc/Vdd)
2.2V~6V
Core Processor
F2MC-8L
Peripherals
POR, PWM, WDT
Program Memory Type
Mask ROM
Core Size
8-Bit
Program Memory Size
32KB 32K x 8
Connectivity
EBI/EMI, Serial I/O, UART/USART
Data Converter
A/D 8x10b
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
66
$19.50000
$1287
MB89637RPFR-G-1370-BND Product Details
MB89637RPFR-G-1370-BND Overview
The package is 64-BQFP-shaped. There are 53 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 8-Bit core architecture. The type of program memory it uses is Mask ROM. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the F2MC-8L MB89630R series of electrical components. Having a size of 32KB 32K x 8, Microcontroller has a program memory of X bytes. A F2MC-8L Core Processor is at the core of this Microcontroller. 32kB is the size of the memory in the IC part. Using a 10MHz frequency, this electronic part can perform efficiently. On the chip, 64 pins are accessible. There is Mask ROM memory on this piece of equipment.
MB89637RPFR-G-1370-BND Features
64-BQFP package Mounting type of Surface Mount Minimum temperature of -40°C
MB89637RPFR-G-1370-BND Applications
There are a lot of Cypress Semiconductor Corp MB89637RPFR-G-1370-BND Microcontroller applications.