32KB 32K x 8 Mask ROM F2MC-8L 8-Bit Microcontroller F2MC-8L MB89630R Series 64 Pin 10MHz 64-BQFP
SOT-23
MB89637RPFR-G-1370-BNDE1 Datasheet
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
64-BQFP
Number of Pins
64
Supplier Device Package
64-QFP (14x20)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
F2MC-8L MB89630R
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Frequency
10MHz
Interface
EBI/EMI, Serial, UART, USART
Memory Size
32kB
Oscillator Type
External
Number of I/O
53
Speed
10MHz
RAM Size
1K x 8
Memory Type
Mask ROM
Voltage - Supply (Vcc/Vdd)
2.2V~6V
Core Processor
F2MC-8L
Peripherals
POR, PWM, WDT
Program Memory Type
Mask ROM
Core Size
8-Bit
Program Memory Size
32KB 32K x 8
Connectivity
EBI/EMI, Serial I/O, UART/USART
Data Converter
A/D 8x10b
RoHS Status
ROHS3 Compliant
MB89637RPFR-G-1370-BNDE1 Product Details
MB89637RPFR-G-1370-BNDE1 Overview
In a 64-BQFP package, the MCU is available. 53 I/Os are available. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. The 8-Bit core is the core of the MCU. There is a Mask ROM type of memory for its program. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. F2MC-8L MB89630R series components make up this electrical component. 32KB 32K x 8 is the size of its program memory. A F2MC-8L Core processor is used to power the device. 32kB is the memory size of the part. The efficiency of this device can be improved when operating at a frequency of 10MHz. Located on the chip are 64 pins. It has built-in Mask ROM memory.
MB89637RPFR-G-1370-BNDE1 Features
64-BQFP package Mounting type of Surface Mount Minimum temperature of -40°C
MB89637RPFR-G-1370-BNDE1 Applications
There are a lot of Cypress Semiconductor Corp MB89637RPFR-G-1370-BNDE1 Microcontroller applications.