32KB 32K x 8 OTP F2MC-8L 8-Bit Microcontroller F2MC-8L MB89630 Series 10MHz 64-DIP (0.750, 19.05mm)
SOT-23
MB89P637P-GT-5055SH Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
26 Weeks
Mounting Type
Through Hole
Package / Case
64-DIP (0.750, 19.05mm)
Supplier Device Package
64-SH-DIP
Operating Temperature
-40°C~85°C TA
Packaging
Tube
Series
F2MC-8L MB89630
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Frequency
10MHz
Interface
EBI/EMI, Serial, UART, USART
Memory Size
32kB
Oscillator Type
External
Number of I/O
53
Speed
10MHz
RAM Size
1K x 8
Memory Type
OTP
Voltage - Supply (Vcc/Vdd)
2.7V~6V
Core Processor
F2MC-8L
Peripherals
POR, PWM, WDT
Program Memory Type
OTP
Core Size
8-Bit
Program Memory Size
32KB 32K x 8
Connectivity
EBI/EMI, Serial I/O, UART/USART
Data Converter
A/D 8x10b
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
32
$19.50000
$624
MB89P637P-GT-5055SH Product Details
MB89P637P-GT-5055SH Overview
In a 64-DIP (0.750, 19.05mm) package, the MCU is available. 53 I/Os are available. The Microcontroller has a mounting type of Through Hole, which indicates that it is mounted conveniently. The 8-Bit core is the core of the MCU. There is a OTP type of memory for its program. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. F2MC-8L MB89630 series components make up this electrical component. 32KB 32K x 8 is the size of its program memory. A F2MC-8L Core processor is used to power the device. 32kB is the memory size of the part. The efficiency of this device can be improved when operating at a frequency of 10MHz. It has built-in OTP memory.
MB89P637P-GT-5055SH Features
64-DIP (0.750, 19.05mm) package Mounting type of Through Hole Minimum temperature of -40°C
MB89P637P-GT-5055SH Applications
There are a lot of Cypress Semiconductor Corp MB89P637P-GT-5055SH Microcontroller applications.