3.3V V Surface Mount GL-P Memory IC GL-P Series 1 Gb kb 13mm mm 110mA mA
SOT-23
S29GL01GP11FFCR10 Datasheet
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Specifications
Name
Value
Type
Parameter
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
0°C~85°C TA
Packaging
Tray
Published
2012
Series
GL-P
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
3V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3.3V
Supply Voltage-Min (Vsup)
3V
Memory Size
1Gb 128M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Organization
1GX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Density
1 Gb
Standby Current-Max
0.000005A
Access Time (Max)
110 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
1K
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
S29GL01GP11FFCR10 Product Details
S29GL01GP11FFCR10 Overview
As far as memory types are concerned, Non-Volatile is considered to be its memory type. It comes in a Tray. There is a 64-LBGA case embedded in it. This chip has an 1Gb 128M x 8 size of memory on it, so a lot of data can be stored on it. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. 0°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. There is a voltage range of 3V~3.6V for the supply voltage. Its recommended mounting type is Surface Mount. The chip has 64 terminations. In total, this part supports 1 functions. In order to function properly, this ic memory chip should be powered by a voltage of 3.3V. A 64-pin package containing this memory device is used to house this device. It uses Surface Mount mounting, which is an efficient, straightforward mounting method. As far as its nominal supply current is concerned, this memory component carries a rating of 110mA. Power supplies for this memory chip are merely 3.3V . Among the GL-P series of memory devices, this part is essential for its applications. To alter the state of certain nonvolatile memory arrays, 3V programming voltage is required. It is important to keep in mind that this memory has 1K specific sized divisions in total.
S29GL01GP11FFCR10 Features
Package / Case: 64-LBGA 64 Pins
S29GL01GP11FFCR10 Applications
There are a lot of Cypress Semiconductor Corp S29GL01GP11FFCR10 Memory applications.