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S29GL01GP13FFIV20

S29GL01GP13FFIV20

S29GL01GP13FFIV20

Cypress Semiconductor Corp

1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 1 Gb kb 13mm mm 110mA mA

SOT-23

S29GL01GP13FFIV20 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-LBGA
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2012
Series GL-P
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 1.65V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 1Gb 128M x 8
Nominal Supply Current 110mA
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Data Bus Width 8b
Organization 1GX1
Memory Width 1
Write Cycle Time - Word, Page 130ns
Density 1 Gb
Standby Current-Max 0.000005A
Access Time (Max) 130 ns
Sync/Async Asynchronous
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 1K
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
S29GL01GP13FFIV20 Product Details

S29GL01GP13FFIV20 Overview


There is a memory type Non-Volatile for this type of device. The case comes in Tray size. There is a 64-LBGA case embedded in it. There is 1Gb 128M x 8 of memory on the chip. The device uses a mainstream FLASH-format memory. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. It is capable of handling a voltage supply of 1.65V~3.6V. The recommended mounting type for memory ics is Surface Mount. It is planted on the chip with 64 terminations. This part supports as many as 1 functions for the comprehensive working procedure. Memory devices such as this one are designed to be powered by 3V and should be used as such. An 64-pin package is used to package this memory device. This chip is configured to use Surface Mount mounting, a straight forward, high-efficiency mounting fashion. This memory chip is rated 110mA for its nominal supply current. When it comes to power supplies, this memory chip only requires 1.8/3.33/3.3V . GL-P series memory ics play a crucial role in the target applications of this part. There is a need for a programming voltage of 3V in order to modify the state of some nonvolatile memory arrays. There are a total of 1K specific sized divisions in this memory.

S29GL01GP13FFIV20 Features


Package / Case: 64-LBGA
64 Pins

S29GL01GP13FFIV20 Applications


There are a lot of Cypress Semiconductor Corp S29GL01GP13FFIV20 Memory applications.

  • hard disk drive (HDD)
  • cell phones
  • networks
  • workstations,
  • embedded logic
  • personal digital assistants
  • telecommunications
  • servers
  • data buffer
  • eSRAM

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