1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 1 Gb kb 13mm mm 110mA mA
SOT-23
S29GL01GP13FFIV20 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2012
Series
GL-P
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
1Gb 128M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Organization
1GX1
Memory Width
1
Write Cycle Time - Word, Page
130ns
Density
1 Gb
Standby Current-Max
0.000005A
Access Time (Max)
130 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
1K
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
S29GL01GP13FFIV20 Product Details
S29GL01GP13FFIV20 Overview
There is a memory type Non-Volatile for this type of device. The case comes in Tray size. There is a 64-LBGA case embedded in it. There is 1Gb 128M x 8 of memory on the chip. The device uses a mainstream FLASH-format memory. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. It is capable of handling a voltage supply of 1.65V~3.6V. The recommended mounting type for memory ics is Surface Mount. It is planted on the chip with 64 terminations. This part supports as many as 1 functions for the comprehensive working procedure. Memory devices such as this one are designed to be powered by 3V and should be used as such. An 64-pin package is used to package this memory device. This chip is configured to use Surface Mount mounting, a straight forward, high-efficiency mounting fashion. This memory chip is rated 110mA for its nominal supply current. When it comes to power supplies, this memory chip only requires 1.8/3.33/3.3V . GL-P series memory ics play a crucial role in the target applications of this part. There is a need for a programming voltage of 3V in order to modify the state of some nonvolatile memory arrays. There are a total of 1K specific sized divisions in this memory.
S29GL01GP13FFIV20 Features
Package / Case: 64-LBGA 64 Pins
S29GL01GP13FFIV20 Applications
There are a lot of Cypress Semiconductor Corp S29GL01GP13FFIV20 Memory applications.