S29GL01GS10TFI010 Overview

In this case, the memory type of the device can be classified as Non-Volatile. Case Tray is available. In the case of 56-TFSOP (0.724, 18.40mm Width), it is embedded within the case. On the chip, there is an 1Gb 64M x 16 memory, which is the size of the chip's memory. FLASH-format memory is used in this device, which is a mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. There is a recommendation that Surface Mount mounting type should be used for this product. A total of 56 terminations have been planted on the chip. In total, this part supports 1 functions. In order to operate this memory device, it must be supplied with 3V of power. A package of 56 pins is used to protect this memory device. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. In terms of its nominal supply current, this memory component is rated at 60mA. Power supplies for this memory chip are merely 3/3.3V . This part, which belongs to the GL-S series of memory devices, plays an important role in its target applications. To alter the state of certain nonvolatile memory arrays, 3V programming voltage is required. There are a total of 1K specific sized divisions in this memory.

S29GL01GS10TFI010 Features

Package / Case: 56-TFSOP (0.724, 18.40mm Width)
56 Pins

S29GL01GS10TFI010 Applications

There are a lot of Cypress Semiconductor Corp S29GL01GS10TFI010 Memory applications.

• servers
• main computer memory
• telecommunications
• embedded logic
• printers
• cell phones
• DVD disk buffer
• eSRAM
• workstations,
• eDRAM