S29GL01GS11TFV023 Overview

Its memory type can be classified as Non-Volatile. The case comes in Tape & Reel (TR) size. Embedded in the 56-TFSOP (0.724, 18.40mm Width) case, memory ics is a single file. The memory size of the chip is 1Gb 64M x 16 Mb. This device uses takes advantage of the FLASH format. -40°C~105°C TA is an extended operating temperature range, making this device ideal for demanding applications. It is supplied votage within 2.7V~3.6V. As far as the mounting type is concerned, Surface Mount is recommended. The chip is terminated with 56 terminations. The comprehensive working procedure is supported by 1 functions in this part. Memory devices such as this one are designed to be powered by 3V and should be used as such. In terms of power requirements, this memory chip uses only 3/3.3V . Among the GL-S series of memory devices, this part is essential for its applications. In terms of power consumption, it can operate at a maximum supply of 0.08mA . It is necessary to apply 3V programming voltage to certain nonvolatile memory arrays in order to change their state. There are a total of 1K specific sized divisions in this memory.

S29GL01GS11TFV023 Features

Package / Case: 56-TFSOP (0.724, 18.40mm Width)

S29GL01GS11TFV023 Applications

There are a lot of Cypress Semiconductor Corp S29GL01GS11TFV023 Memory applications.

• networks
• supercomputers
• main computer memory
• hard disk drive (HDD)
• eDRAM
• telecommunications
• personal computers
• networking
• mainframes
• personal digital assistants