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S29GL01GS12DHVV10

S29GL01GS12DHVV10

S29GL01GS12DHVV10

Cypress Semiconductor Corp

1.8/3.33/3.3V V Surface Mount GL-S Memory IC GL-S Series 1 Gb kb 9mm mm

SOT-23

S29GL01GS12DHVV10 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-LBGA
Number of Pins 64
Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2007
Series GL-S
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 1.65V~3.6V
Terminal Position BOTTOM
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 1Gb 64M x 16
Memory Type Non-Volatile
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.08mA
Access Time 120ns
Memory Format FLASH
Memory Interface Parallel
Memory Width 16
Write Cycle Time - Word, Page 60ns
Address Bus Width 26b
Density 1 Gb
Standby Current-Max 0.0002A
Programming Voltage 3V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 1K
Sector Size 64K
Page Size 32B
Ready/Busy YES
Boot Block BOTTOM/TOP
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 9mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
260 $9.18038 $2386.8988
S29GL01GS12DHVV10 Product Details

S29GL01GS12DHVV10 Overview


Its memory type can be classified as Non-Volatile. There is a Tray case available. Embedded in the 64-LBGA case, memory ics is a single file. This chip has an 1Gb 64M x 16 size of memory on it, so a lot of data can be stored on it. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. The device's extended operating temperature range of -40°C~105°C TA makes it ideal for many demanding applications. A voltage of 1.65V~3.6V is possible to be applied to the supply. The recommended mounting type for this device is Surface Mount. A total of 64 terminations have been planted on the chip. In total, 1 functions are supported by this part. In order to power this memory device, 3V will be necessary. An 64-pin package is used to package this memory device. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. Talking about power supplies, this memory chip requires merely 1.8/3.33/3.3V. It is an important component of the GL-S series memory devices used in a variety of applications. This device can be operated from a maximum supply current of 0.08mA under ideal conditions. It is necessary to apply 3V programming voltage to certain nonvolatile memory arrays in order to change their state. A total of 1K specific sizes of divisions are present in this memory.

S29GL01GS12DHVV10 Features


Package / Case: 64-LBGA
64 Pins

S29GL01GS12DHVV10 Applications


There are a lot of Cypress Semiconductor Corp S29GL01GS12DHVV10 Memory applications.

  • eSRAM
  • eDRAM
  • workstations,
  • personal digital assistants
  • networking
  • DVD disk buffer
  • personal computers
  • mainframes
  • Camcorders
  • data buffer

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