1.8/3.33/3.3V V Surface Mount GL-S Memory IC GL-S Series 1 Gb kb 9mm mm
SOT-23
S29GL01GS12DHVV10 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Published
2007
Series
GL-S
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
BOTTOM
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
1Gb 64M x 16
Memory Type
Non-Volatile
Operating Mode
ASYNCHRONOUS
Supply Current-Max
0.08mA
Access Time
120ns
Memory Format
FLASH
Memory Interface
Parallel
Memory Width
16
Write Cycle Time - Word, Page
60ns
Address Bus Width
26b
Density
1 Gb
Standby Current-Max
0.0002A
Programming Voltage
3V
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
1K
Sector Size
64K
Page Size
32B
Ready/Busy
YES
Boot Block
BOTTOM/TOP
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
9mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
260
$9.18038
$2386.8988
S29GL01GS12DHVV10 Product Details
S29GL01GS12DHVV10 Overview
Its memory type can be classified as Non-Volatile. There is a Tray case available. Embedded in the 64-LBGA case, memory ics is a single file. This chip has an 1Gb 64M x 16 size of memory on it, so a lot of data can be stored on it. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. The device's extended operating temperature range of -40°C~105°C TA makes it ideal for many demanding applications. A voltage of 1.65V~3.6V is possible to be applied to the supply. The recommended mounting type for this device is Surface Mount. A total of 64 terminations have been planted on the chip. In total, 1 functions are supported by this part. In order to power this memory device, 3V will be necessary. An 64-pin package is used to package this memory device. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. Talking about power supplies, this memory chip requires merely 1.8/3.33/3.3V. It is an important component of the GL-S series memory devices used in a variety of applications. This device can be operated from a maximum supply current of 0.08mA under ideal conditions. It is necessary to apply 3V programming voltage to certain nonvolatile memory arrays in order to change their state. A total of 1K specific sizes of divisions are present in this memory.
S29GL01GS12DHVV10 Features
Package / Case: 64-LBGA 64 Pins
S29GL01GS12DHVV10 Applications
There are a lot of Cypress Semiconductor Corp S29GL01GS12DHVV10 Memory applications.