1.8/3.33/3.3V V GL-P Memory IC GL-P Series 128 Mb kb 13mm mm
SOT-23
S29GL128P11FFIV22 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
64-LBGA
Surface Mount
YES
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
GL-P
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
128Mb 16M x 8
Memory Type
Non-Volatile
Supply Current-Max
0.11mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
128MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Density
128 Mb
Standby Current-Max
0.000005A
Access Time (Max)
110 ns
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
128
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Width
11mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
400
$4.27505
$1710.02
S29GL128P11FFIV22 Product Details
S29GL128P11FFIV22 Overview
Non-Volatile is its memory type. It comes in a Tape & Reel (TR). The case is embedded in 64-LBGA. The memory size of the chip is 128Mb 16M x 8 Mb. FLASH-format memory is used in this device, which is a mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. The device is capable of handling a supply voltage of 1.65V~3.6V. There is a recommended mounting type of Surface Mount for it. On the chip, there are 64 terminations that are planted. It supports up to 1 functions for comprehensive operation. The memory device designed for this application has been designed to be powered by an 3V power supply. It is encased in an 64-pin package that contains this ic memory chip. This memory chip requires only 1.8/3.33/3.3V of power. GL-P series memory ics play a crucial role in the target applications of this part. In order for it to operate properly, memory ics requires a maximum supply current of 0.11mA . It is necessary to apply 3V programming voltage to certain nonvolatile memory arrays in order to change their state. As a result, this memory has 128 specific divisions of varying sizes.
S29GL128P11FFIV22 Features
Package / Case: 64-LBGA 64 Pins
S29GL128P11FFIV22 Applications
There are a lot of Cypress Semiconductor Corp S29GL128P11FFIV22 Memory applications.