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S29GL128P11FFIV22

S29GL128P11FFIV22

S29GL128P11FFIV22

Cypress Semiconductor Corp

1.8/3.33/3.3V V GL-P Memory IC GL-P Series 128 Mb kb 13mm mm

SOT-23

S29GL128P11FFIV22 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series GL-P
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 1.65V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 128Mb 16M x 8
Memory Type Non-Volatile
Supply Current-Max 0.11mA
Memory Format FLASH
Memory Interface Parallel
Organization 128MX1
Memory Width 1
Write Cycle Time - Word, Page 110ns
Density 128 Mb
Standby Current-Max 0.000005A
Access Time (Max) 110 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 128
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
400 $4.27505 $1710.02
S29GL128P11FFIV22 Product Details

S29GL128P11FFIV22 Overview


Non-Volatile is its memory type. It comes in a Tape & Reel (TR). The case is embedded in 64-LBGA. The memory size of the chip is 128Mb 16M x 8 Mb. FLASH-format memory is used in this device, which is a mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. The device is capable of handling a supply voltage of 1.65V~3.6V. There is a recommended mounting type of Surface Mount for it. On the chip, there are 64 terminations that are planted. It supports up to 1 functions for comprehensive operation. The memory device designed for this application has been designed to be powered by an 3V power supply. It is encased in an 64-pin package that contains this ic memory chip. This memory chip requires only 1.8/3.33/3.3V of power. GL-P series memory ics play a crucial role in the target applications of this part. In order for it to operate properly, memory ics requires a maximum supply current of 0.11mA . It is necessary to apply 3V programming voltage to certain nonvolatile memory arrays in order to change their state. As a result, this memory has 128 specific divisions of varying sizes.

S29GL128P11FFIV22 Features


Package / Case: 64-LBGA
64 Pins

S29GL128P11FFIV22 Applications


There are a lot of Cypress Semiconductor Corp S29GL128P11FFIV22 Memory applications.

  • eSRAM
  • Camcorders
  • main computer memory
  • data buffer
  • hard disk drive (HDD)
  • personal computers
  • multimedia computers
  • embedded logic
  • servers
  • printers

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