1.8/3.33/3.3V V GL-P Memory IC GL-P Series 13mm mm
SOT-23
S29GL128P11FFIV23 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
64-LBGA
Surface Mount
YES
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2015
Series
GL-P
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
128Mb 16M x 8
Memory Type
Non-Volatile
Operating Mode
ASYNCHRONOUS
Supply Current-Max
0.11mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
128MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Standby Current-Max
0.000005A
Memory Density
134217728 bit
Access Time (Max)
110 ns
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
128
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Width
11mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,600
$3.83764
$3.83764
S29GL128P11FFIV23 Product Details
S29GL128P11FFIV23 Overview
There is a memory type Non-Volatile for this type of device. The case comes in Tape & Reel (TR) size. The case is embedded in 64-LBGA. There is 128Mb 16M x 8 of memory on the chip. FLASH-format memory is used in this device, which is a mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. A voltage of 1.65V~3.6V can be supplied to memory ics. It is recommended that the mounting type be Surface Mount. The chip contains 64 terminations. As many as 1 functions are supported for comprehensive working. In order to function properly, this ic memory chip should be powered by a voltage of 3V. The memory device is enclosed in a package with an 64-pin connector. In terms of power requirements, this memory chip uses only 1.8/3.33/3.3V . This part, which belongs to the GL-P series of memory devices, plays an important role in its target applications. It is able to operate from a max supply current of 0.11mA. The programming voltage required for certain nonvolatile memory arrays is 3V. A total of 128 specific sizes of divisions are present in this memory.
S29GL128P11FFIV23 Features
Package / Case: 64-LBGA 64 Pins
S29GL128P11FFIV23 Applications
There are a lot of Cypress Semiconductor Corp S29GL128P11FFIV23 Memory applications.