S29GL128P11TAI010 Overview

There is a Non-Volatile memory type associated with this device. It comes in a Tray. The case is embedded in 56-TFSOP (0.724, 18.40mm Width). There is an 128Mb 16M x 8 memory capacity on the chip. The device uses a mainstream FLASH-format memory. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. The recommended mounting type for this device is Surface Mount. The chip contains 56 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to power this memory device, 3V will be necessary. This memory chip requires only 3/3.3V of power. As a member of the GL-P series memory devices, this part plays an important role for its target applications. In terms of power consumption, it can operate at a maximum supply of 0.11mA . A programming voltage of 3V is required to change a nonvolatile memory array's state. As a result, this memory has 128 specific divisions of varying sizes.

S29GL128P11TAI010 Features

Package / Case: 56-TFSOP (0.724, 18.40mm Width)

S29GL128P11TAI010 Applications

There are a lot of Cypress Semiconductor Corp S29GL128P11TAI010 Memory applications.

• supercomputers
• workstations,
• servers
• personal computers
• hard disk drive (HDD)
• networks
• eDRAM
• eSRAM
• mainframes
• Camcorders