1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 128 Mb kb 18.4mm mm 110mA mA
SOT-23
S29GL128P11TFIV13 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
56-TFSOP (0.724, 18.40mm Width)
Number of Pins
56
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2011
Series
GL-P
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
56
ECCN Code
3A991.B.1.A
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
128M 16M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Organization
128MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Density
128 Mb
Standby Current-Max
0.000005A
Access Time (Max)
110 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
128
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.2mm
Length
18.4mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
S29GL128P11TFIV13 Product Details
S29GL128P11TFIV13 Overview
Non-Volatile is its memory type. Case Tape & Reel (TR) is available. As you can see, it is embedded in 56-TFSOP (0.724, 18.40mm Width) case. The memory size of the chip is 128M 16M x 8 Mb. There is a mainstream memory format used by this device, which is called FLASH-format memory. -40°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. It is capable of handling a voltage supply of 1.65V~3.6V. Its recommended mounting type is Surface Mount. A total of 56 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. This ic memory chip is designed to be supplied with 3V. A 56-pin package containing this memory device is used to house this device. This chip is configured to use Surface Mount mounting, a straight forward, high-efficiency mounting fashion. There is a nominal supply current rating of 110mA for this memory component. As for the power supply, this memory chip only needs 1.8/3.33/3.3V . This part plays an important role in applications that target the GL-P series of memory devices. A programming voltage of 3V is required to alter the state of certain nonvolatile memory arrays. A total of 128 specific sizes of divisions are present in this memory.