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S29GL128P11TFIV13

S29GL128P11TFIV13

S29GL128P11TFIV13

Cypress Semiconductor Corp

1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 128 Mb kb 18.4mm mm 110mA mA

SOT-23

S29GL128P11TFIV13 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 56-TFSOP (0.724, 18.40mm Width)
Number of Pins 56
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2011
Series GL-P
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 1.65V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.5mm
[email protected] Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 128M 16M x 8
Nominal Supply Current 110mA
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Data Bus Width 8b
Organization 128MX1
Memory Width 1
Write Cycle Time - Word, Page 110ns
Density 128 Mb
Standby Current-Max 0.000005A
Access Time (Max) 110 ns
Sync/Async Asynchronous
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 128
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.2mm
Length 18.4mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,000 $3.83765 $3.83765
2,000 $3.71385 $7.4277
S29GL128P11TFIV13 Product Details

S29GL128P11TFIV13 Overview


Non-Volatile is its memory type. Case Tape & Reel (TR) is available. As you can see, it is embedded in 56-TFSOP (0.724, 18.40mm Width) case. The memory size of the chip is 128M 16M x 8 Mb. There is a mainstream memory format used by this device, which is called FLASH-format memory. -40°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. It is capable of handling a voltage supply of 1.65V~3.6V. Its recommended mounting type is Surface Mount. A total of 56 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. This ic memory chip is designed to be supplied with 3V. A 56-pin package containing this memory device is used to house this device. This chip is configured to use Surface Mount mounting, a straight forward, high-efficiency mounting fashion. There is a nominal supply current rating of 110mA for this memory component. As for the power supply, this memory chip only needs 1.8/3.33/3.3V . This part plays an important role in applications that target the GL-P series of memory devices. A programming voltage of 3V is required to alter the state of certain nonvolatile memory arrays. A total of 128 specific sizes of divisions are present in this memory.

S29GL128P11TFIV13 Features


Package / Case: 56-TFSOP (0.724, 18.40mm Width)
56 Pins

S29GL128P11TFIV13 Applications


There are a lot of Cypress Semiconductor Corp S29GL128P11TFIV13 Memory applications.

  • supercomputers
  • graphics card
  • personal computers
  • multimedia computers
  • printers
  • telecommunications
  • cell phones
  • hard disk drive (HDD)
  • DVD disk buffer
  • nonvolatile BIOS memory

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