1.8/3.33/3.3V V GL-P Memory IC GL-P Series 128 Mb kb 18.4mm mm
SOT-23
S29GL128P11TFIV23 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
56-TFSOP (0.724, 18.40mm Width)
Surface Mount
YES
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2003
Series
GL-P
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
56
ECCN Code
3A991.B.1.A
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
40
JESD-30 Code
R-PDSO-G56
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
128Mb 16M x 8
Memory Type
Non-Volatile
Supply Current-Max
0.11mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
128MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Density
128 Mb
Standby Current-Max
0.000005A
Access Time (Max)
110 ns
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
128
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.2mm
Length
18.4mm
Width
14mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,000
$3.83765
$3.83765
S29GL128P11TFIV23 Product Details
S29GL128P11TFIV23 Overview
Non-Volatile is the type of memory it has. It comes in a Tape & Reel (TR). Embedded in the 56-TFSOP (0.724, 18.40mm Width) case, memory ics is a single file. 128Mb 16M x 8 is the chip's memory size. Memory data is stored in FLASH-format, which is common in mainstream devices. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. A supply voltage of 1.65V~3.6V can be applied to it. There is a recommended mounting type of Surface Mount for it. 56 terminations are planted on the chip. It supports up to 1 functions for comprehensive operation. In order to power this memory device, 3V will be necessary. This memory chip requires a mere 1.8/3.33/3.3V of power. This part is part of the GL-P series of memory devices, which play a key role in its target applications. In terms of power consumption, it can operate at a maximum supply of 0.11mA . It is necessary to apply 3V programming voltage to certain nonvolatile memory arrays in order to change their state. As a result, this memory has 128 specific divisions of varying sizes.
S29GL128P11TFIV23 Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
S29GL128P11TFIV23 Applications
There are a lot of Cypress Semiconductor Corp S29GL128P11TFIV23 Memory applications.