In this case, the memory type of the device can be classified as Non-Volatile. Tray-cases are available. An embedded 56-TFSOP (0.724, 18.40mm Width) case surrounds memory ics. A memory chip with a capacity of 128Mb 8M x 16 is used on this device. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~105°C TA. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. There is a recommendation that Surface Mount mounting type should be used for this product. The chip has 56 terminations. The comprehensive working procedure of this part involves 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. As a member of the GL-S series memory devices, this part plays an important role for its target applications. Nonvolatile memory arrays require 3V programming voltages to change their states.
S29GL128S10TFB020 Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
S29GL128S10TFB020 Applications
There are a lot of Cypress Semiconductor Corp S29GL128S10TFB020 Memory applications.