1.8/3.33/3.3V V GL-S Memory IC GL-S Series 18.4mm mm
SOT-23
S29GL128S11TFVV20 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
56-TFSOP (0.724, 18.40mm Width)
Surface Mount
YES
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Series
GL-S
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
56
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PDSO-G56
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
128Mb 8M x 16
Memory Type
Non-Volatile
Operating Mode
ASYNCHRONOUS
Supply Current-Max
0.08mA
Access Time
110ns
Memory Format
FLASH
Memory Interface
Parallel
Organization
8MX16
Memory Width
16
Write Cycle Time - Word, Page
60ns
Standby Current-Max
0.0002A
Memory Density
134217728 bit
Programming Voltage
3V
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
128
Sector Size
64K
Page Size
16words
Ready/Busy
YES
Boot Block
BOTTOM/TOP
Common Flash Interface
YES
Height Seated (Max)
1.2mm
Length
18.4mm
Width
14mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
91
$4.55604
$414.59964
S29GL128S11TFVV20 Product Details
S29GL128S11TFVV20 Overview
There is a memory type Non-Volatile for this type of device. There is a Tray case available. An embedded 56-TFSOP (0.724, 18.40mm Width) case surrounds memory ics. 128Mb 8M x 16 is the chip's memory size. This device uses a FLASH-format memory, which is of mainstream design. -40°C~105°C TA is an extended operating temperature range, making this device ideal for demanding applications. A voltage of 1.65V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. On the chip, there are 56 terminations. There are 1 functions supported by this part as part of the comprehensive working process. A voltage of 3V is required for the operation of this memory device. As for power supplies, this memory chip requires just 1.8/3.33/3.3V . GL-S series memory ics play a crucial role in the target applications of this part. A maximum supply current of 0.08mA can be used to operate this device. Nonvolatile memory arrays require 3V programming voltage to change their state. The manufacturer has divided this memory into 128 different sections that have specific sizes in total.
S29GL128S11TFVV20 Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
S29GL128S11TFVV20 Applications
There are a lot of Cypress Semiconductor Corp S29GL128S11TFVV20 Memory applications.