3/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA
SOT-23
S29GL256P10FFI022 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2003
Series
GL-P
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 32M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Organization
256MX1
Memory Width
1
Write Cycle Time - Word, Page
100ns
Density
256 Mb
Standby Current-Max
0.000005A
Access Time (Max)
100 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
400
$6.37900
$2551.6
S29GL256P10FFI022 Product Details
S29GL256P10FFI022 Overview
A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tape & Reel (TR) case as well. The file is embedded in a 64-LBGA case. 256Mb 32M x 8 is the chip's memory size. FLASH-format memory is used in this device, which is a mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. It is recommended to mount it in the Surface Mount mounting type. On the chip, there are 64 terminations. There are 1 functions supported by this part as part of the comprehensive working process. This ic memory chip is designed to be supplied with 3V. It is encased in an 64-pin package that contains this ic memory chip. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. As far as its nominal supply current is concerned, this memory component carries a rating of 110mA. Power supplies for this memory chip are merely 3/3.3V . This part is part of the GL-P series of memory devices, which play a key role in its target applications. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. This ic memory chip has 256 specifically sized divisions in total.
S29GL256P10FFI022 Features
Package / Case: 64-LBGA 64 Pins
S29GL256P10FFI022 Applications
There are a lot of Cypress Semiconductor Corp S29GL256P10FFI022 Memory applications.