3/3.3V V GL-P Memory IC GL-P Series 256 Mb kb 18.4mm mm
SOT-23
S29GL256P10TAI010 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
56-TFSOP (0.724, 18.40mm Width)
Surface Mount
YES
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2015
Series
GL-P
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
56
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Lead (Sn/Pb)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
240
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PDSO-G56
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 32M x 8
Memory Type
Non-Volatile
Supply Current-Max
0.11mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
256MX1
Memory Width
1
Write Cycle Time - Word, Page
100ns
Density
256 Mb
Standby Current-Max
0.000005A
Access Time (Max)
100 ns
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.2mm
Length
18.4mm
Width
14mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
182
$4.11137
$748.26934
S29GL256P10TAI010 Product Details
S29GL256P10TAI010 Overview
As far as its memory type goes, it falls into the Non-Volatile category. There is a Tray case available. 56-TFSOP (0.724, 18.40mm Width) case encloses it. The memory size of the chip is 256Mb 32M x 8 Mb. This device uses a FLASH-format memory, which is of mainstream design. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. It is supplied votage within 2.7V~3.6V. Its recommended mounting type is Surface Mount. 56 terminations are planted on the chip. The part supports at least 1 functions to ensure a comprehensive working process. There is a requirement for 3V to be supplied to this ic memory chip in order to operate. As for the power supply, this memory chip only needs 3/3.3V . Its target applications rely heavily on the GL-P series memory devices. This memory ics is capable of operating with an input current of 0.11mA at max. A programming voltage of 3V is needed to alter the state of certain nonvolatile memory arrays. The manufacturer has divided this memory into 256 different sections that have specific sizes in total.
S29GL256P10TAI010 Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
S29GL256P10TAI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL256P10TAI010 Memory applications.