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S29GL256P10TFI010

S29GL256P10TFI010

S29GL256P10TFI010

Cypress Semiconductor Corp

3/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 18.4mm mm 110mA mA

SOT-23

S29GL256P10TFI010 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 56-TFSOP (0.724, 18.40mm Width)
Number of Pins 56
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2015
Series GL-P
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56
Termination SMD/SMT
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.5mm
[email protected] Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Nominal Supply Current 110mA
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Data Bus Width 8b
Memory Width 1
Write Cycle Time - Word, Page 100ns
Density 256 Mb
Standby Current-Max 0.000005A
Access Time (Max) 100 ns
Sync/Async Asynchronous
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.2mm
Length 18.4mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $8.17000 $8.17
10 $7.51500 $75.15
25 $7.35920 $183.98
91 $7.33297 $667.30027
182 $6.57846 $1197.27972
273 $6.37897 $1741.45881
546 $6.06676 $3312.45096
1,001 $5.85428 $5.85428
S29GL256P10TFI010 Product Details

S29GL256P10TFI010 Overview


As far as its memory type goes, it falls into the Non-Volatile category. The case comes in Tray size. The file is embedded in a 56-TFSOP (0.724, 18.40mm Width) case. The chip has an 256Mb 32M x 8 memory. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. The supply voltage can be up to 2.7V~3.6V. Its recommended mounting type is Surface Mount. The chip contains 56 terminations. There are 1 functions supported by this part as part of the comprehensive working process. An 3V supply is required for this ic memory chip to operate properly. The memory device has an 56-pin package, which encloses it in a small package. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. As far as its nominal supply current is concerned, this memory component carries a rating of 110mA. This memory chip requires a mere 3/3.3V of power. This part plays an important role in applications that target the GL-P series of memory devices. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. As a result, this memory has 256 specific divisions of varying sizes.

S29GL256P10TFI010 Features


Package / Case: 56-TFSOP (0.724, 18.40mm Width)
56 Pins

S29GL256P10TFI010 Applications


There are a lot of Cypress Semiconductor Corp S29GL256P10TFI010 Memory applications.

  • mainframes
  • eDRAM
  • embedded logic
  • multimedia computers
  • eSRAM
  • Cache memory
  • data buffer
  • supercomputers
  • hard disk drive (HDD)
  • nonvolatile BIOS memory

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