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S29GL256P11FAI022

S29GL256P11FAI022

S29GL256P11FAI022

Cypress Semiconductor Corp

3/3.3V V GL-P Memory IC GL-P Series 13mm mm

SOT-23

S29GL256P11FAI022 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2015
Series GL-P
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 30
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Memory Type Non-Volatile
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.11mA
Memory Format FLASH
Memory Interface Parallel
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 110ns
Standby Current-Max 0.000005A
Memory Density 268435456 bit
Access Time (Max) 110 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
RoHS Status ROHS3 Compliant
S29GL256P11FAI022 Product Details

S29GL256P11FAI022 Overview


Non-Volatile is the type of memory it has. Case Tape & Reel (TR) is available. The case is embedded in 64-LBGA. On the chip, there is an 256Mb 32M x 8 memory, which is the size of the chip's memory. FLASH-format memory is used in this device, which is a mainstream design. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. The recommended mounting type for memory ics is Surface Mount. There are 64 terminations on the chip. In total, 1 functions are supported by this part. In order to power this memory device, 3V will be necessary. The memory device is enclosed in a package with an 64-pin connector. Talking about power supplies, this memory chip requires merely 3/3.3V. As a member of the GL-P series memory devices, this part plays an important role for its target applications. In order to operate your device, you will need to provide a maximum supply current of 0.11mA. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. A total of 256 specifically sized divisions are contained in this memory.

S29GL256P11FAI022 Features


Package / Case: 64-LBGA
64 Pins

S29GL256P11FAI022 Applications


There are a lot of Cypress Semiconductor Corp S29GL256P11FAI022 Memory applications.

  • printers
  • eSRAM
  • personal computers
  • Camcorders
  • embedded logic
  • personal digital assistants
  • eDRAM
  • workstations,
  • nonvolatile BIOS memory
  • cell phones

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