3/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA
SOT-23
S29GL256P11FFI013 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2004
Series
GL-P
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 32M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Organization
256MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Density
256 Mb
Standby Current-Max
0.000005A
Access Time (Max)
110 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,600
$5.85428
$5.85428
S29GL256P11FFI013 Product Details
S29GL256P11FFI013 Overview
Non-Volatile is the type of memory it has. In addition, memory ics is available in a Tape & Reel (TR) case as well. In the case of 64-LBGA, it is embedded within the case. The memory size of the chip is 256Mb 32M x 8 Mb. The device uses a mainstream FLASH-format memory. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. It is capable of handling a voltage supply of 2.7V~3.6V. A Surface Mount mounting type is recommended for this product. 64 terminations are planted on the chip. This part supports as many as 1 functions for the comprehensive working procedure. In order to operate this memory device, it must be supplied with 3V of power. It is encased in an 64-pin package that contains this ic memory chip. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. Memory chip's nominal supply current is 110mA. In terms of power requirements, this memory chip uses only 3/3.3V . Among the GL-P series of memory devices, this part is essential for its applications. A programming voltage of 3V is required to change a nonvolatile memory array's state. It is important to keep in mind that this memory has 256 specific sized divisions in total.
S29GL256P11FFI013 Features
Package / Case: 64-LBGA 64 Pins
S29GL256P11FFI013 Applications
There are a lot of Cypress Semiconductor Corp S29GL256P11FFI013 Memory applications.