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S29GL256P11FFI022

S29GL256P11FFI022

S29GL256P11FFI022

Cypress Semiconductor Corp

3/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA

SOT-23

S29GL256P11FFI022 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-LBGA
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2015
Series GL-P
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Nominal Supply Current 110mA
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 110ns
Density 256 Mb
Standby Current-Max 0.000005A
Access Time (Max) 110 ns
Sync/Async Asynchronous
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
400 $6.37900 $2551.6
S29GL256P11FFI022 Product Details

S29GL256P11FFI022 Overview


There is a Non-Volatile memory type associated with this device. You can get memory ics in a Tape & Reel (TR) case. As you can see, it is embedded in 64-LBGA case. Memory size on the chip is 256Mb 32M x 8. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. A voltage of 2.7V~3.6V can be supplied to memory ics. There is a recommendation that Surface Mount mounting type should be used for this product. There are 64 terminations on the chip. There are 1 functions supported by this part as part of the comprehensive working process. An 3V supply is required for this ic memory chip to operate properly. The ic memory chip comes in a package with 64 pins that allows it to be connected to a computer. Memory chips configured with Surface Mount mounting achieve high efficiency and simplicity. As far as the nominal supply current of this memory component is concerned, it is rated at 110mA. Power supplies for this memory chip are merely 3/3.3V . In its target applications, this memory ics plays an important role as a member of the GL-P series of memory devices. The programming voltage required for certain nonvolatile memory arrays is 3V. Total, there are 256 specifically sized divisions within this memory.

S29GL256P11FFI022 Features


Package / Case: 64-LBGA
64 Pins

S29GL256P11FFI022 Applications


There are a lot of Cypress Semiconductor Corp S29GL256P11FFI022 Memory applications.

  • multimedia computers
  • eSRAM
  • eDRAM
  • workstations,
  • mainframes
  • Cache memory
  • graphics card
  • data buffer
  • servers
  • supercomputers

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