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S29GL256P11FFIV10

S29GL256P11FFIV10

S29GL256P11FFIV10

Cypress Semiconductor Corp

1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA

SOT-23

S29GL256P11FFIV10 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-LBGA
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2012
Series GL-P
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 1.65V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Nominal Supply Current 110mA
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Data Bus Width 8b
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 110ns
Density 256 Mb
Standby Current-Max 0.000005A
Access Time (Max) 110 ns
Sync/Async Asynchronous
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $8.17000 $8.17
10 $7.51500 $75.15
25 $7.35920 $183.98
50 $7.33300 $366.65
180 $6.57844 $1184.1192
360 $6.37900 $2296.44
540 $6.06676 $3276.0504
1,080 $5.85428 $5.85428
S29GL256P11FFIV10 Product Details

S29GL256P11FFIV10 Overview


As far as its memory type goes, it falls into the Non-Volatile category. The case comes in Tray size. An embedded 64-LBGA case surrounds memory ics. 256Mb 32M x 8 is the chip's memory size. FLASH-format memory is used in this device, which is a mainstream design. -40°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. A voltage of 1.65V~3.6V can be supplied to memory ics. The recommended mounting type for this device is Surface Mount. A total of 64 terminations have been planted on the chip. The part supports at least 1 functions to ensure a comprehensive working process. In order to operate this memory device, it must be supplied with 3V of power. A 64-pin package containing this memory device is used to house this device. In this chip, Surface Mount mounting is used, a straightforward, high-efficiency mounting method. As far as the nominal supply current of this memory component is concerned, it is rated at 110mA. When it comes to power supplies, this memory chip only requires 1.8/3.33/3.3V . GL-P series memory devices play an important role in the applications they target. Nonvolatile memory arrays require 3V programming voltage to change their state. This ic memory chip has 256 specifically sized divisions in total.

S29GL256P11FFIV10 Features


Package / Case: 64-LBGA
64 Pins

S29GL256P11FFIV10 Applications


There are a lot of Cypress Semiconductor Corp S29GL256P11FFIV10 Memory applications.

  • personal computers
  • graphics card
  • workstations,
  • networks
  • Camcorders
  • networking
  • printers
  • nonvolatile BIOS memory
  • Cache memory
  • multimedia computers

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