1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA
SOT-23
S29GL256P11FFIV10 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2012
Series
GL-P
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 32M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Organization
256MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Density
256 Mb
Standby Current-Max
0.000005A
Access Time (Max)
110 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$8.17000
$8.17
10
$7.51500
$75.15
25
$7.35920
$183.98
50
$7.33300
$366.65
180
$6.57844
$1184.1192
360
$6.37900
$2296.44
540
$6.06676
$3276.0504
1,080
$5.85428
$5.85428
S29GL256P11FFIV10 Product Details
S29GL256P11FFIV10 Overview
As far as its memory type goes, it falls into the Non-Volatile category. The case comes in Tray size. An embedded 64-LBGA case surrounds memory ics. 256Mb 32M x 8 is the chip's memory size. FLASH-format memory is used in this device, which is a mainstream design. -40°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. A voltage of 1.65V~3.6V can be supplied to memory ics. The recommended mounting type for this device is Surface Mount. A total of 64 terminations have been planted on the chip. The part supports at least 1 functions to ensure a comprehensive working process. In order to operate this memory device, it must be supplied with 3V of power. A 64-pin package containing this memory device is used to house this device. In this chip, Surface Mount mounting is used, a straightforward, high-efficiency mounting method. As far as the nominal supply current of this memory component is concerned, it is rated at 110mA. When it comes to power supplies, this memory chip only requires 1.8/3.33/3.3V . GL-P series memory devices play an important role in the applications they target. Nonvolatile memory arrays require 3V programming voltage to change their state. This ic memory chip has 256 specifically sized divisions in total.
S29GL256P11FFIV10 Features
Package / Case: 64-LBGA 64 Pins
S29GL256P11FFIV10 Applications
There are a lot of Cypress Semiconductor Corp S29GL256P11FFIV10 Memory applications.