1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA
SOT-23
S29GL256P11FFIV23 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2017
Series
GL-P
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 32M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Organization
256MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Density
256 Mb
Standby Current-Max
0.000005A
Access Time (Max)
110 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
S29GL256P11FFIV23 Product Details
S29GL256P11FFIV23 Overview
Non-Volatile is its memory type. You can get memory ics in a Tape & Reel (TR) case. It is available in 64-LBGA case. There is an 256Mb 32M x 8 memory capacity on the chip. This device utilizes a FLASH format memory which is of mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. It is supplied votage within 1.65V~3.6V. There is a recommended mounting type of Surface Mount for it. On the chip, there are 64 terminations that are planted. In total, 1 functions are supported by this part. The memory device is designed to be supplied with an 3V volt power supply in order to operate properly. The memory device is enclosed in a package with an 64-pin connector. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. The nominal supply current of this memory component is 110mA. Talking about power supplies, this memory chip requires merely 1.8/3.33/3.3V. Among the GL-P series of memory devices, this part is essential for its applications. A programming voltage of 3V is required to change a nonvolatile memory array's state. This ic memory chip has 256 specifically sized divisions in total.
S29GL256P11FFIV23 Features
Package / Case: 64-LBGA 64 Pins
S29GL256P11FFIV23 Applications
There are a lot of Cypress Semiconductor Corp S29GL256P11FFIV23 Memory applications.