3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA
SOT-23
S29GL256P90FFCR10 Datasheet
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In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
0°C~85°C TA
Packaging
Tray
Published
2013
Series
GL-P
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
3V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3.3V
Supply Voltage-Min (Vsup)
3V
Memory Size
256Mb 32M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Organization
256MX1
Memory Width
1
Write Cycle Time - Word, Page
90ns
Density
256 Mb
Standby Current-Max
0.000005A
Access Time (Max)
90 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
180
$6.57844
$1184.1192
S29GL256P90FFCR10 Product Details
S29GL256P90FFCR10 Overview
A Non-Volatile-type memory can be classified as the memory type of this device. It is supplied votage within Tray. The case is embedded in 64-LBGA. A memory chip with a capacity of 256Mb 32M x 8 is used on this device. This device utilizes a FLASH format memory which is of mainstream design. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of 0°C~85°C TA. It is supplied votage within 3V~3.6V. The recommended mounting type for memory ics is Surface Mount. The chip has 64 terminations. There are 1 functions supported by this part as part of the comprehensive working process. An 3.3V supply is required for this ic memory chip to operate properly. There are 64 pins on the package of the memory device. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. In terms of its nominal supply current, this memory component is rated at 110mA. In terms of power requirements, this memory chip uses only 3.3V . Among the GL-P series of memory devices, this part is essential for its applications. To alter the state of certain nonvolatile memory arrays, 3V programming voltage is required. A total of 256 specifically sized divisions are contained in this memory.
S29GL256P90FFCR10 Features
Package / Case: 64-LBGA 64 Pins
S29GL256P90FFCR10 Applications
There are a lot of Cypress Semiconductor Corp S29GL256P90FFCR10 Memory applications.