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S29GL256P90FFCR12

S29GL256P90FFCR12

S29GL256P90FFCR12

Cypress Semiconductor Corp

3.3V V GL-P Memory IC GL-P Series 13mm mm

SOT-23

S29GL256P90FFCR12 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64
Operating Temperature 0°C~70°C TA
Packaging Tape & Reel (TR)
Published 2003
Series GL-P
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 3V~3.6V
Terminal Position BOTTOM
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1mm
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Memory Size 256Mb 32M x 8
Memory Type Non-Volatile
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.11mA
Memory Format FLASH
Memory Interface Parallel
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 90ns
Standby Current-Max 0.000005A
Memory Density 268435456 bit
Access Time (Max) 90 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
RoHS Status ROHS3 Compliant
S29GL256P90FFCR12 Product Details

S29GL256P90FFCR12 Overview


As far as its memory type goes, it falls into the Non-Volatile category. The case comes in Tape & Reel (TR) size. As you can see, it is embedded in 64-LBGA case. This chip has an 256Mb 32M x 8 size of memory on it, so a lot of data can be stored on it. This device utilizes a FLASH format memory which is of mainstream design. Due to its wide temperature range of 0°C~70°C TA, this device is well suited to a wide range of applications that require high performance. It is supplied votage within 3V~3.6V. Its recommended mounting type is Surface Mount. As you can see from the diagram, the chip is planted with 64 terminations. This part supports as many as 1 functions for the comprehensive working procedure. In order to operate this memory device, it must be supplied with 3.3V of power. It is encased in an 64-pin package that contains this ic memory chip. In terms of power requirements, this memory chip uses only 3.3V . Among the GL-P series of memory devices, this part is essential for its applications. As far as the supply current is concerned, it can be operated with a maximum of 0.11mA of currentA programming voltage of 3V is needed to alter the state of certain nonvolatile memory arrays. There are a total of 256 specific sized divisions in this memory.

S29GL256P90FFCR12 Features


Package / Case: 64-LBGA
64 Pins

S29GL256P90FFCR12 Applications


There are a lot of Cypress Semiconductor Corp S29GL256P90FFCR12 Memory applications.

  • telecommunications
  • multimedia computers
  • main computer memory
  • hard disk drive (HDD)
  • cell phones
  • eDRAM
  • networks
  • workstations,
  • eSRAM
  • Camcorders

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