Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 18.4mm mm 110mA mA
SOT-23
S29GL256P90TFCR10 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
56-TFSOP (0.724, 18.40mm Width)
Number of Pins
56
Operating Temperature
0°C~85°C TA
Packaging
Tray
Published
2012
Series
GL-P
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
56
ECCN Code
3A991.B.1.A
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
40
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Memory Size
256Mb 32M x 8
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
8b
Memory Width
1
Write Cycle Time - Word, Page
90ns
Density
256 Mb
Standby Current-Max
0.000005A
Access Time (Max)
90 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.2mm
Length
18.4mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
91
$7.33297
$667.30027
S29GL256P90TFCR10 Product Details
S29GL256P90TFCR10 Overview
A Non-Volatile-type memory can be classified as the memory type of this device. Tray-cases are available. There is a 56-TFSOP (0.724, 18.40mm Width) case embedded in it. There is an 256Mb 32M x 8 memory capacity on the chip. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. A supply voltage of 3V~3.6V can be applied to it. The recommended mounting type for memory ics is Surface Mount. On the chip, there are 56 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. The memory device designed for this application has been designed to be powered by an 3.3V power supply. A package of 56 pins is used to protect this memory device. It is noted that the operating supply voltage of this memory is 3.3V. Memory chips configured with Surface Mount mounting achieve high efficiency and simplicity. There is a nominal supply current rating of 110mA for this memory component. This part plays an important role in applications that target the GL-P series of memory devices. Nonvolatile memory arrays require 3V programming voltage to change their state. As a result, this memory has 256 specific divisions of varying sizes.