3/3.3V V Surface Mount GL-S Memory IC GL-S Series 256 Mb kb 9mm mm 60mA mA 16b b
SOT-23
S29GL256S10DHI023 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
GL-S
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 16M x 16
Nominal Supply Current
60mA
Memory Type
Non-Volatile
Access Time
100ns
Memory Format
FLASH
Memory Interface
Parallel
Organization
32MX8
Memory Width
8
Write Cycle Time - Word, Page
60ns
Address Bus Width
24b
Density
256 Mb
Standby Current-Max
0.0001A
Sync/Async
Asynchronous
Word Size
16b
Programming Voltage
2.7V
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
64K
Page Size
16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
9mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
2,200
$4.45500
$8.91
S29GL256S10DHI023 Product Details
S29GL256S10DHI023 Overview
In this case, the memory type of the device can be classified as Non-Volatile. It is supplied votage within Tape & Reel (TR). As you can see, it is embedded in 64-LBGA case. The memory size of the chip is 256Mb 16M x 16 Mb. This device uses a FLASH-format memory, which is of mainstream design. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. Its recommended mounting type is Surface Mount. On the chip, there are 64 terminations. In total, 1 functions are supported by this part. In order to power this memory device, 3V will be necessary. There are 64 pins on the package of the memory device. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. It is rated for a nominal supply current of 60mA for this memory component. As for the power supply, this memory chip only needs 3/3.3V . Its target applications rely heavily on the GL-S series memory devices. A programming voltage of 2.7V is required to change a nonvolatile memory array's state. This ic memory chip has 256 specifically sized divisions in total.
S29GL256S10DHI023 Features
Package / Case: 64-LBGA 64 Pins
S29GL256S10DHI023 Applications
There are a lot of Cypress Semiconductor Corp S29GL256S10DHI023 Memory applications.