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S29GL256S10DHI023

S29GL256S10DHI023

S29GL256S10DHI023

Cypress Semiconductor Corp

3/3.3V V Surface Mount GL-S Memory IC GL-S Series 256 Mb kb 9mm mm 60mA mA 16b b

SOT-23

S29GL256S10DHI023 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-LBGA
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series GL-S
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 16M x 16
Nominal Supply Current 60mA
Memory Type Non-Volatile
Access Time 100ns
Memory Format FLASH
Memory Interface Parallel
Organization 32MX8
Memory Width 8
Write Cycle Time - Word, Page 60ns
Address Bus Width 24b
Density 256 Mb
Standby Current-Max 0.0001A
Sync/Async Asynchronous
Word Size 16b
Programming Voltage 2.7V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 64K
Page Size 16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 9mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,200 $4.45500 $8.91
S29GL256S10DHI023 Product Details

S29GL256S10DHI023 Overview


In this case, the memory type of the device can be classified as Non-Volatile. It is supplied votage within Tape & Reel (TR). As you can see, it is embedded in 64-LBGA case. The memory size of the chip is 256Mb 16M x 16 Mb. This device uses a FLASH-format memory, which is of mainstream design. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. Its recommended mounting type is Surface Mount. On the chip, there are 64 terminations. In total, 1 functions are supported by this part. In order to power this memory device, 3V will be necessary. There are 64 pins on the package of the memory device. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. It is rated for a nominal supply current of 60mA for this memory component. As for the power supply, this memory chip only needs 3/3.3V . Its target applications rely heavily on the GL-S series memory devices. A programming voltage of 2.7V is required to change a nonvolatile memory array's state. This ic memory chip has 256 specifically sized divisions in total.

S29GL256S10DHI023 Features


Package / Case: 64-LBGA
64 Pins

S29GL256S10DHI023 Applications


There are a lot of Cypress Semiconductor Corp S29GL256S10DHI023 Memory applications.

  • personal computers
  • networks
  • eSRAM
  • graphics card
  • printers
  • hard disk drive (HDD)
  • eDRAM
  • main computer memory
  • data buffer
  • telecommunications

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