3/3.3V V GL-S Memory IC GL-S Series 256 Mb kb 13mm mm
SOT-23
S29GL256S10FHI020 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
64-LBGA
Surface Mount
YES
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2015
Series
GL-S
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
TIN SILVER COPPER
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 16M x 16
Memory Type
Non-Volatile
Supply Current-Max
0.08mA
Access Time
100ns
Memory Format
FLASH
Memory Interface
Parallel
Organization
16MX16
Memory Width
16
Write Cycle Time - Word, Page
60ns
Address Bus Width
24b
Density
256 Mb
Standby Current-Max
0.0001A
Programming Voltage
2.7V
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
64K
Page Size
32B
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
180
$5.40539
$972.9702
S29GL256S10FHI020 Product Details
S29GL256S10FHI020 Overview
Non-Volatile is its memory type. It comes in a Tray. In the case of 64-LBGA, it is embedded within the case. On the chip, there is an 256Mb 16M x 16 memory, which is the size of the chip's memory. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. There is a voltage range of 2.7V~3.6V for the supply voltage. It is recommended to mount it in the Surface Mount mounting type. The chip is terminated with 64 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. The memory device designed for this application has been designed to be powered by an 3V power supply. The memory device has an 64-pin package, which encloses it in a small package. This memory chip requires a mere 3/3.3V of power. In its target applications, this memory ics plays an important role as a member of the GL-S series of memory devices. In terms of power consumption, it can operate at a maximum supply of 0.08mA . 2.7V programming voltage is required to change the state of certain nonvolatile memory arrays. The manufacturer has divided this memory into 256 different sections that have specific sizes in total.
S29GL256S10FHI020 Features
Package / Case: 64-LBGA 64 Pins
S29GL256S10FHI020 Applications
There are a lot of Cypress Semiconductor Corp S29GL256S10FHI020 Memory applications.