3/3.3V V Surface Mount GL-P Memory IC GL-P Series 512 Mb kb 13mm mm 110mA mA
SOT-23
S29GL512P10FFI010 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2015
Series
GL-P
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
512Mb 32M x 16
Nominal Supply Current
110mA
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Organization
512MX1
Memory Width
1
Write Cycle Time - Word, Page
100ns
Density
512 Mb
Standby Current-Max
0.000005A
Access Time (Max)
100 ns
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
512
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Width
11mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
S29GL512P10FFI010 Product Details
S29GL512P10FFI010 Overview
A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. In the case of 64-LBGA, it is embedded within the case. Memory size on the chip is 512Mb 32M x 16. Memory data is stored in FLASH-format, which is common in mainstream devices. A wide operating temperature range makes this device ideal for a variety of demanding applications. The supply voltage can be up to 2.7V~3.6V. As far as the mounting type is concerned, Surface Mount is recommended. It is planted on the chip with 64 terminations. In total, this part supports 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. The ic memory chip comes in a package with 64 pins that allows it to be connected to a computer. The memory chip utilizes a straightforward, high-efficiency mounting method, Surface Mount mounting. This memory chip is rated 110mA for its nominal supply current. As for the power supply, this memory chip only needs 3/3.3V . It is an important component of the GL-P series memory devices used in a variety of applications. A programming voltage of 3V is required to alter the state of certain nonvolatile memory arrays. There are a total of 512 specific sized divisions in this memory.
S29GL512P10FFI010 Features
Package / Case: 64-LBGA 64 Pins
S29GL512P10FFI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL512P10FFI010 Memory applications.