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S29GL512P10FFI010

S29GL512P10FFI010

S29GL512P10FFI010

Cypress Semiconductor Corp

3/3.3V V Surface Mount GL-P Memory IC GL-P Series 512 Mb kb 13mm mm 110mA mA

SOT-23

S29GL512P10FFI010 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-LBGA
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2015
Series GL-P
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 512Mb 32M x 16
Nominal Supply Current 110mA
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Organization 512MX1
Memory Width 1
Write Cycle Time - Word, Page 100ns
Density 512 Mb
Standby Current-Max 0.000005A
Access Time (Max) 100 ns
Sync/Async Asynchronous
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 512
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
S29GL512P10FFI010 Product Details

S29GL512P10FFI010 Overview


A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. In the case of 64-LBGA, it is embedded within the case. Memory size on the chip is 512Mb 32M x 16. Memory data is stored in FLASH-format, which is common in mainstream devices. A wide operating temperature range makes this device ideal for a variety of demanding applications. The supply voltage can be up to 2.7V~3.6V. As far as the mounting type is concerned, Surface Mount is recommended. It is planted on the chip with 64 terminations. In total, this part supports 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. The ic memory chip comes in a package with 64 pins that allows it to be connected to a computer. The memory chip utilizes a straightforward, high-efficiency mounting method, Surface Mount mounting. This memory chip is rated 110mA for its nominal supply current. As for the power supply, this memory chip only needs 3/3.3V . It is an important component of the GL-P series memory devices used in a variety of applications. A programming voltage of 3V is required to alter the state of certain nonvolatile memory arrays. There are a total of 512 specific sized divisions in this memory.

S29GL512P10FFI010 Features


Package / Case: 64-LBGA
64 Pins

S29GL512P10FFI010 Applications


There are a lot of Cypress Semiconductor Corp S29GL512P10FFI010 Memory applications.

  • cell phones
  • Cache memory
  • eSRAM
  • DVD disk buffer
  • printers
  • main computer memory
  • supercomputers
  • personal computers
  • nonvolatile BIOS memory
  • workstations,

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