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S29GL512P10FFI020

S29GL512P10FFI020

S29GL512P10FFI020

Cypress Semiconductor Corp

3/3.3V V GL-P Memory IC GL-P Series 13mm mm

SOT-23

S29GL512P10FFI020 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2015
Series GL-P
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 512Mb 32M x 16
Memory Type Non-Volatile
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.11mA
Memory Format FLASH
Memory Interface Parallel
Organization 512MX1
Memory Width 1
Write Cycle Time - Word, Page 100ns
Standby Current-Max 0.000005A
Memory Density 536870912 bit
Access Time (Max) 100 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 512
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
RoHS Status ROHS3 Compliant
S29GL512P10FFI020 Product Details

S29GL512P10FFI020 Overview


Its memory type can be classified as Non-Volatile. Case Tray is available. The file is embedded in a 64-LBGA case. 512Mb 32M x 16 is the chip's memory size. This device uses a FLASH-format memory, which is of mainstream design. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. It is supplied votage within 2.7V~3.6V. There is a recommendation that Surface Mount mounting type should be used for this product. On the chip, there are 64 terminations that are planted. It supports up to 1 functions for comprehensive operation. Memory devices such as this one are designed to be powered by 3V and should be used as such. Power supplies for this memory chip are merely 3/3.3V . It is an important component of the GL-P series memory devices used in a variety of applications. This memory ics is capable of operating with an input current of 0.11mA at max. There is a need for a programming voltage of 3V in order to modify the state of some nonvolatile memory arrays. There are a total of 512 specific sized divisions in this memory.

S29GL512P10FFI020 Features


Package / Case: 64-LBGA

S29GL512P10FFI020 Applications


There are a lot of Cypress Semiconductor Corp S29GL512P10FFI020 Memory applications.

  • supercomputers
  • Cache memory
  • printers
  • embedded logic
  • telecommunications
  • cell phones
  • DVD disk buffer
  • networking
  • mainframes
  • workstations,

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