1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 512 Mb kb 13mm mm
SOT-23
S29GL512P12FFIV12 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2003
Series
GL-P
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
BOTTOM
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
512Mb 32M x 16
Memory Type
Non-Volatile
Supply Current-Max
0.11mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
512MX1
Memory Width
1
Write Cycle Time - Word, Page
120ns
Density
512 Mb
Standby Current-Max
0.000005A
Access Time (Max)
120 ns
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
512
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Width
11mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$10.67000
$10.67
500
$10.5633
$5281.65
1000
$10.4566
$10456.6
1500
$10.3499
$15524.85
2000
$10.2432
$20486.4
2500
$10.1365
$25341.25
S29GL512P12FFIV12 Product Details
S29GL512P12FFIV12 Overview
A Non-Volatile-type memory can be classified as the memory type of this device. Case Tape & Reel (TR) is available. The file is embedded in a 64-LBGA case. There is an 512Mb 32M x 16 memory capacity on the chip. This device utilizes a FLASH format memory which is of mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. The device is capable of handling a supply voltage of 1.65V~3.6V volts. A Surface Mount mounting type is recommended for this product. On the chip, there are 64 terminations that are planted. The comprehensive working procedure of this part involves 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. An 64-pin package is used to package this memory device. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. When it comes to power supplies, this memory chip only requires 1.8/3.33/3.3V . This part plays an important role in applications that target the GL-P series of memory devices. The device is able to run from a max supply current of 0.11mA , so it can be used in any environment. A programming voltage of 3V is required to change a nonvolatile memory array's state. There are a total of 512 specific sized divisions in this memory.
S29GL512P12FFIV12 Features
Package / Case: 64-LBGA 64 Pins
S29GL512P12FFIV12 Applications
There are a lot of Cypress Semiconductor Corp S29GL512P12FFIV12 Memory applications.