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S29GL512P12FFIV12

S29GL512P12FFIV12

S29GL512P12FFIV12

Cypress Semiconductor Corp

1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 512 Mb kb 13mm mm

SOT-23

S29GL512P12FFIV12 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-LBGA
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2003
Series GL-P
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 1.65V~3.6V
Terminal Position BOTTOM
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 512Mb 32M x 16
Memory Type Non-Volatile
Supply Current-Max 0.11mA
Memory Format FLASH
Memory Interface Parallel
Organization 512MX1
Memory Width 1
Write Cycle Time - Word, Page 120ns
Density 512 Mb
Standby Current-Max 0.000005A
Access Time (Max) 120 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 512
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $10.67000 $10.67
500 $10.5633 $5281.65
1000 $10.4566 $10456.6
1500 $10.3499 $15524.85
2000 $10.2432 $20486.4
2500 $10.1365 $25341.25
S29GL512P12FFIV12 Product Details

S29GL512P12FFIV12 Overview


A Non-Volatile-type memory can be classified as the memory type of this device. Case Tape & Reel (TR) is available. The file is embedded in a 64-LBGA case. There is an 512Mb 32M x 16 memory capacity on the chip. This device utilizes a FLASH format memory which is of mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. The device is capable of handling a supply voltage of 1.65V~3.6V volts. A Surface Mount mounting type is recommended for this product. On the chip, there are 64 terminations that are planted. The comprehensive working procedure of this part involves 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. An 64-pin package is used to package this memory device. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. When it comes to power supplies, this memory chip only requires 1.8/3.33/3.3V . This part plays an important role in applications that target the GL-P series of memory devices. The device is able to run from a max supply current of 0.11mA , so it can be used in any environment. A programming voltage of 3V is required to change a nonvolatile memory array's state. There are a total of 512 specific sized divisions in this memory.

S29GL512P12FFIV12 Features


Package / Case: 64-LBGA
64 Pins

S29GL512P12FFIV12 Applications


There are a lot of Cypress Semiconductor Corp S29GL512P12FFIV12 Memory applications.

  • printers
  • cell phones
  • hard disk drive (HDD)
  • nonvolatile BIOS memory
  • multimedia computers
  • embedded logic
  • main computer memory
  • Camcorders
  • eSRAM
  • personal digital assistants

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