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S29GL512S10DHI013

S29GL512S10DHI013

S29GL512S10DHI013

Cypress Semiconductor Corp

3/3.3V V GL-S Memory IC GL-S Series 9mm mm

SOT-23

S29GL512S10DHI013 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2016
Series GL-S
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 512Mb 32M x 16
Memory Type Non-Volatile
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.08mA
Access Time 100ns
Memory Format FLASH
Memory Interface Parallel
Memory Width 8
Write Cycle Time - Word, Page 60ns
Standby Current-Max 0.0001A
Memory Density 536870912 bit
Programming Voltage 3V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 512
Sector Size 64K
Page Size 16words
Ready/Busy YES
Boot Block BOTTOM/TOP
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 9mm
Width 9mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,200 $5.75505 $11.5101
S29GL512S10DHI013 Product Details

S29GL512S10DHI013 Overview


Non-Volatile is its memory type. It comes in a Tape & Reel (TR). 64-LBGA case encloses it. A memory chip with a capacity of 512Mb 32M x 16 is used on this device. There is a mainstream memory format used by this device, which is called FLASH-format memory. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. It is supplied votage within 2.7V~3.6V. The recommended mounting type for memory ics is Surface Mount. As you can see from the diagram, the chip is planted with 64 terminations. There are 1 functions supported by this part as part of the comprehensive working process. The memory device designed for this application has been designed to be powered by an 3V power supply. A package of 64 pins is used to protect this memory device. As for power supplies, this memory chip requires just 3/3.3V . It is an important component of the GL-S series memory devices used in a variety of applications. As far as the supply current is concerned, it can be operated with a maximum of 0.08mA of currentThe programming voltage required for certain nonvolatile memory arrays is 3V. This ic memory chip has 512 specifically sized divisions in total.

S29GL512S10DHI013 Features


Package / Case: 64-LBGA
64 Pins

S29GL512S10DHI013 Applications


There are a lot of Cypress Semiconductor Corp S29GL512S10DHI013 Memory applications.

  • telecommunications
  • mainframes
  • printers
  • eSRAM
  • hard disk drive (HDD)
  • graphics card
  • supercomputers
  • DVD disk buffer
  • Cache memory
  • personal digital assistants

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