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S29GL512S11DHI023

S29GL512S11DHI023

S29GL512S11DHI023

Cypress Semiconductor Corp

3/3.3V V GL-S Memory IC GL-S Series 9mm mm

SOT-23

S29GL512S11DHI023 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2016
Series GL-S
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 512Mb 32M x 16
Memory Type Non-Volatile
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.08mA
Access Time 110ns
Memory Format FLASH
Memory Interface Parallel
Memory Width 8
Write Cycle Time - Word, Page 60ns
Standby Current-Max 0.0001A
Memory Density 536870912 bit
Programming Voltage 2.7V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 512
Sector Size 64K
Page Size 16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 9mm
Width 9mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,200 $5.75505 $11.5101
S29GL512S11DHI023 Product Details

S29GL512S11DHI023 Overview


There is a memory type Non-Volatile for this type of device. Tape & Reel (TR)-cases are available. Embedded in the 64-LBGA case, memory ics is a single file. 512Mb 32M x 16 is the chip's memory size. This device utilizes a FLASH format memory which is of mainstream design. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. There is a voltage range of 2.7V~3.6V for the supply voltage. A Surface Mount mounting type is recommended for this product. It is planted on the chip with 64 terminations. This part supports as many as 1 functions for the comprehensive working procedure. Memory devices such as this one are designed to be powered by 3V and should be used as such. There are 64 pins on the package of the memory device. As for the power supply, this memory chip only needs 3/3.3V . As a member of the GL-S series memory devices, this part plays an important role for its target applications. The device is able to run from a max supply current of 0.08mA , so it can be used in any environment. Nonvolatile memory arrays require 2.7V programming voltages to change their states. This ic memory chip has 512 specifically sized divisions in total.

S29GL512S11DHI023 Features


Package / Case: 64-LBGA
64 Pins

S29GL512S11DHI023 Applications


There are a lot of Cypress Semiconductor Corp S29GL512S11DHI023 Memory applications.

  • Cache memory
  • nonvolatile BIOS memory
  • multimedia computers
  • personal digital assistants
  • data buffer
  • eSRAM
  • supercomputers
  • cell phones
  • hard disk drive (HDD)
  • workstations,

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