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S29GL512S11FHI010

S29GL512S11FHI010

S29GL512S11FHI010

Cypress Semiconductor Corp

3/3.3V V GL-S Memory IC GL-S Series 512 Mb kb 13mm mm

SOT-23

S29GL512S11FHI010 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2003
Series GL-S
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 512Mb 32M x 16
Memory Type Non-Volatile
Supply Current-Max 0.08mA
Access Time 110ns
Memory Format FLASH
Memory Interface Parallel
Organization 32MX16
Memory Width 16
Write Cycle Time - Word, Page 60ns
Address Bus Width 25b
Density 512 Mb
Standby Current-Max 0.0001A
Programming Voltage 2.7V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 512
Sector Size 64K
Page Size 32B
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
180 $6.68994 $1204.1892
S29GL512S11FHI010 Product Details

S29GL512S11FHI010 Overview


A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. An embedded 64-LBGA case surrounds memory ics. There is 512Mb 32M x 16 of memory on the chip. This device uses takes advantage of the FLASH format. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. A voltage of 2.7V~3.6V can be supplied to memory ics. The recommended mounting type for this device is Surface Mount. There are 64 terminations on the chip. This part supports as many as 1 functions for the comprehensive working procedure. In order to power this memory device, 3V will be necessary. An 64-pin package is used to package this memory device. Talking about power supplies, this memory chip requires merely 3/3.3V. In its target applications, this memory ics plays an important role as a member of the GL-S series of memory devices. As far as the supply current is concerned, it can be operated with a maximum of 0.08mA of currentTo alter the state of certain nonvolatile memory arrays, 2.7V programming voltage is required. There are 512 specific divisions in this ic memory chip, and each division has a specific size.

S29GL512S11FHI010 Features


Package / Case: 64-LBGA
64 Pins

S29GL512S11FHI010 Applications


There are a lot of Cypress Semiconductor Corp S29GL512S11FHI010 Memory applications.

  • Camcorders
  • data buffer
  • hard disk drive (HDD)
  • workstations,
  • personal digital assistants
  • multimedia computers
  • networks
  • networking
  • graphics card
  • personal computers

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