3/3.3V V GL-S Memory IC GL-S Series 512 Mb kb 13mm mm
SOT-23
S29GL512S11FHI010 Datasheet
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In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
64-LBGA
Surface Mount
YES
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2003
Series
GL-S
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
512Mb 32M x 16
Memory Type
Non-Volatile
Supply Current-Max
0.08mA
Access Time
110ns
Memory Format
FLASH
Memory Interface
Parallel
Organization
32MX16
Memory Width
16
Write Cycle Time - Word, Page
60ns
Address Bus Width
25b
Density
512 Mb
Standby Current-Max
0.0001A
Programming Voltage
2.7V
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
512
Sector Size
64K
Page Size
32B
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
180
$6.68994
$1204.1892
S29GL512S11FHI010 Product Details
S29GL512S11FHI010 Overview
A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. An embedded 64-LBGA case surrounds memory ics. There is 512Mb 32M x 16 of memory on the chip. This device uses takes advantage of the FLASH format. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. A voltage of 2.7V~3.6V can be supplied to memory ics. The recommended mounting type for this device is Surface Mount. There are 64 terminations on the chip. This part supports as many as 1 functions for the comprehensive working procedure. In order to power this memory device, 3V will be necessary. An 64-pin package is used to package this memory device. Talking about power supplies, this memory chip requires merely 3/3.3V. In its target applications, this memory ics plays an important role as a member of the GL-S series of memory devices. As far as the supply current is concerned, it can be operated with a maximum of 0.08mA of currentTo alter the state of certain nonvolatile memory arrays, 2.7V programming voltage is required. There are 512 specific divisions in this ic memory chip, and each division has a specific size.
S29GL512S11FHI010 Features
Package / Case: 64-LBGA 64 Pins
S29GL512S11FHI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL512S11FHI010 Memory applications.