There is a memory type Non-Volatile for this type of device. Tray-cases are available. An embedded 56-TFSOP (0.724, 18.40mm Width) case surrounds memory ics. On the chip, there is an 512Mb 32M x 16 memory, which is the size of the chip's memory. FLASH-format memory is used in this device, which is a mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. As far as the mounting type is concerned, Surface Mount is recommended. 56 terminations are planted on the chip. For a comprehensive working procedure, this part supports as many as 1 functions. There is a requirement for 3V to be supplied to this ic memory chip in order to operate. This memory chip requires only 3/3.3V of power. Among the GL-S series of memory devices, this part is essential for its applications. In terms of power consumption, it can operate at a maximum supply of 0.08mA . A programming voltage of 2.7V is required to alter the state of certain nonvolatile memory arrays. The manufacturer has divided this memory into 512 different sections that have specific sizes in total.
S29GL512S11TFV020 Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
S29GL512S11TFV020 Applications
There are a lot of Cypress Semiconductor Corp S29GL512S11TFV020 Memory applications.