S29GL512S11TFV023 Overview

In this case, the memory type of the device can be classified as Non-Volatile. Case Tape & Reel (TR) is available. In the case of 56-TFSOP (0.724, 18.40mm Width), it is embedded within the case. There is an 512Mb 32M x 16 memory capacity on the chip. FLASH-format memory is used in this device, which is a mainstream design. -40°C~105°C TA is an extended operating temperature range, making this device ideal for demanding applications. A voltage of 2.7V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip is terminated with 56 terminations. In total, 1 functions are supported by this part. A voltage of 3V is required for the operation of this memory device. There is only a single power supply required for this memory chip. It is an important component of the GL-S series memory devices used in a variety of applications. In order to operate your device, you will need to provide a maximum supply current of 0.08mA. Nonvolatile memory arrays require 2.7V programming voltages to change their states. There are 512 specific divisions in this ic memory chip, and each division has a specific size.

S29GL512S11TFV023 Features

Package / Case: 56-TFSOP (0.724, 18.40mm Width)

S29GL512S11TFV023 Applications

There are a lot of Cypress Semiconductor Corp S29GL512S11TFV023 Memory applications.

• networking
• DVD disk buffer
• eSRAM
• Cache memory
• printers
• networks
• mainframes
• data buffer
• embedded logic
• nonvolatile BIOS memory