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S29PL127J60BAW000

S29PL127J60BAW000

S29PL127J60BAW000

Cypress Semiconductor Corp

3/3.3V V PL-J Memory IC PL-J Series 11mm mm

SOT-23

S29PL127J60BAW000 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 80-VFBGA
Surface Mount YES
Operating Temperature -25°C~85°C TA
Packaging Tray
Series PL-J
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 80
ECCN Code 3A991.B.1.A
Additional Feature TOP AND BOTTOM BOOT BLOCK
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.8mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B80
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 128Mb 8M x 16
Memory Type Non-Volatile
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.07mA
Memory Format FLASH
Memory Interface Parallel
Organization 8MX16
Memory Width 16
Write Cycle Time - Word, Page 60ns
Standby Current-Max 0.000005A
Memory Density 134217728 bit
Access Time (Max) 60 ns
Programming Voltage 3V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 16254
Sector Size 4K32K
Page Size 8words
Ready/Busy YES
Boot Block BOTTOM/TOP
Common Flash Interface YES
Height Seated (Max) 1mm
Length 11mm
Width 8mm
RoHS Status Non-RoHS Compliant
S29PL127J60BAW000 Product Details

S29PL127J60BAW000 Overview


Non-Volatile is its memory type. It is supplied votage within Tray. The case is embedded in 80-VFBGA. A memory chip with a capacity of 128Mb 8M x 16 is used on this device. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. Its recommended mounting type is Surface Mount. The chip has 80 terminations. The part supports at least 1 functions to ensure a comprehensive working process. In order to operate this memory device, it must be supplied with 3V of power. Despite all its benefits, this memory chip also offers TOP AND BOTTOM BOOT BLOCK for improved system performance. This memory chip requires a mere 3/3.3V of power. It is an important component of the PL-J series memory devices used in a variety of applications. The device is able to run from a max supply current of 0.07mA , so it can be used in any environment. A programming voltage of 3V is required to alter the state of certain nonvolatile memory arrays. A total of 16254 specifically sized divisions are contained in this memory.

S29PL127J60BAW000 Features


Package / Case: 80-VFBGA
Additional Feature:TOP AND BOTTOM BOOT BLOCK

S29PL127J60BAW000 Applications


There are a lot of Cypress Semiconductor Corp S29PL127J60BAW000 Memory applications.

  • hard disk drive (HDD)
  • printers
  • main computer memory
  • servers
  • Cache memory
  • personal computers
  • DVD disk buffer
  • Camcorders
  • mainframes
  • eSRAM

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