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S29PL127J60TAI130

S29PL127J60TAI130

S29PL127J60TAI130

Cypress Semiconductor Corp

3/3.3V V Surface Mount PL-J Memory IC PL-J Series 128 Mb kb 18.4mm mm

SOT-23

S29PL127J60TAI130 Datasheet

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Specifications
Name Value
Type Parameter
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 56-TFSOP (0.724, 18.40mm Width)
Operating Temperature -40°C~85°C
Packaging Tray
Published 2015
Series PL-J
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56
Additional Feature TOP AND BOTTOM BOOT BLOCK
HTS Code 8542.31.00.01
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.5mm
[email protected] Reflow Temperature-Max (s) 30
JESD-30 Code R-PDSO-G56
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 128M 8M x 16
Memory Type Non-Volatile
Supply Current-Max 0.07mA
Memory Format FLASH
Memory Interface Parallel
Organization 8MX16
Memory Width 16
Write Cycle Time - Word, Page 60ns
Address Bus Width 23b
Density 128 Mb
Standby Current-Max 0.000005A
Access Time (Max) 60 ns
Programming Voltage 3V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 16254
Sector Size 4K32K
Page Size 8words
Ready/Busy YES
Boot Block BOTTOM/TOP
Common Flash Interface YES
Height Seated (Max) 1.2mm
Length 18.4mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
S29PL127J60TAI130 Product Details

S29PL127J60TAI130 Overview


There is a Non-Volatile memory type associated with this device. It is supplied votage within Tray. It is available in 56-TFSOP (0.724, 18.40mm Width) case. Memory size on the chip is 128M 8M x 16. FLASH-format memory is used in this device, which is a mainstream design. This device has an extended operating temperature range of -40°C~85°C, so it's perfect for a wide range of demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. Its recommended mounting type is Surface Mount. As you can see from the diagram, the chip is planted with 56 terminations. In total, this part supports 1 functions. This ic memory chip is designed to be supplied with 3V. This chip is configured to use Surface Mount mounting, a straight forward, high-efficiency mounting fashion. This chip features all the merits of a conventional chip, but it also features TOP AND BOTTOM BOOT BLOCK to improve system performance. When it comes to power supplies, this memory chip only requires 3/3.3V . As a member of the PL-J series memory devices, this part plays an important role for its target applications. With a maximum supply current of 0.07mA , it is able to operate from a variety of supplies. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. Total, there are 16254 specifically sized divisions within this memory.

S29PL127J60TAI130 Features


Package / Case: 56-TFSOP (0.724, 18.40mm Width)
Additional Feature:TOP AND BOTTOM BOOT BLOCK

S29PL127J60TAI130 Applications


There are a lot of Cypress Semiconductor Corp S29PL127J60TAI130 Memory applications.

  • servers
  • personal computers
  • telecommunications
  • supercomputers
  • Cache memory
  • DVD disk buffer
  • hard disk drive (HDD)
  • workstations,
  • Camcorders
  • eDRAM

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