3/3.3V V ML-1 Memory IC ML-1 Series 2 Gb kb 11mm mm
SOT-23
S34ML02G104BHI010 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
20 Weeks
Mounting Type
Surface Mount
Package / Case
63-VFBGA
Surface Mount
YES
Number of Pins
63
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2014
Series
ML-1
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
63
HTS Code
8542.32.00.51
Technology
FLASH - NAND
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.8mm
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
2Gb 128M x 16
Memory Type
Non-Volatile
Supply Current-Max
0.04mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
128MX16
Memory Width
16
Write Cycle Time - Word, Page
25ns
Address Bus Width
28b
Density
2 Gb
Standby Current-Max
0.00005A
Access Time (Max)
25 ns
Programming Voltage
3V
Data Polling
NO
Toggle Bit
NO
Command User Interface
YES
Number of Sectors/Size
2K
Sector Size
64K
Page Size
2kB
Ready/Busy
YES
Height Seated (Max)
1mm
Length
11mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
S34ML02G104BHI010 Product Details
S34ML02G104BHI010 Overview
A Non-Volatile-type memory can be classified as the memory type of this device. You can get memory ics in a Tray case. The file is embedded in a 63-VFBGA case. The memory size of the chip is 2Gb 128M x 16 Mb. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. It is capable of handling a voltage supply of 2.7V~3.6V. As far as the mounting type is concerned, Surface Mount is recommended. It is planted on the chip with 63 terminations. In total, 1 functions are supported by this part. Memory devices such as this one are designed to be powered by 3.3V and should be used as such. It is encased in an 63-pin package that contains this ic memory chip. Talking about power supplies, this memory chip requires merely 3/3.3V. It is an important component of the ML-1 series memory devices used in a variety of applications. A maximum supply current of 0.04mA can be used to operate this device. To alter the state of certain nonvolatile memory arrays, 3V programming voltage is required. It is important to keep in mind that this memory has 2K specific sized divisions in total.
S34ML02G104BHI010 Features
Package / Case: 63-VFBGA 63 Pins
S34ML02G104BHI010 Applications
There are a lot of Cypress Semiconductor Corp S34ML02G104BHI010 Memory applications.