There is a memory type Non-Volatile for this type of device. The case comes in the Tape & Reel (TR) style. In the case of 64-LBGA, it is embedded within the case. Memory size on the chip is 2Gb 256M x 8 128M x 16. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. A voltage of 3V~3.6V is possible to be applied to the supply. There is a recommended mounting type of Surface Mount for it. On the chip, there are 64 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. A voltage of 3.3V is required for the operation of this memory device. Among the GL-P series of memory devices, this part is essential for its applications. To alter the state of certain nonvolatile memory arrays, 3V programming voltage is required.
S70GL02GP11FAIR13 Features
Package / Case: 64-LBGA
S70GL02GP11FAIR13 Applications
There are a lot of Cypress Semiconductor Corp S70GL02GP11FAIR13 Memory applications.