3/3.3V V Surface Mount GL-S Memory IC GL-S Series 2 Gb kb 13mm mm 60mA mA
SOT-23
S70GL02GS11FHI010 Datasheet
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In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2010
Series
GL-S
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
HTS Code
8542.32.00.71
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
2Gb 128M x 16
Nominal Supply Current
60mA
Memory Type
Non-Volatile
Access Time
110ns
Memory Format
FLASH
Memory Interface
Parallel
Data Bus Width
16b
Organization
128MX16
Memory Width
16
Address Bus Width
27b
Density
2 Gb
Standby Current-Max
0.0002A
Sync/Async
Asynchronous
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
2K
Sector Size
128K
Page Size
16/32words
Ready/Busy
YES
Boot Block
BOTTOM/TOP
Common Flash Interface
YES
Height
1.4mm
Length
13mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$21.25000
$21.25
10
$19.79100
$197.91
25
$19.57360
$489.34
50
$19.09060
$954.53
180
$16.76011
$3016.8198
360
$16.19258
$5829.3288
540
$15.75787
$8509.2498
S70GL02GS11FHI010 Product Details
S70GL02GS11FHI010 Overview
In terms of its memory type, it can be classified as Non-Volatile. Case Tray is available. Embedded in the 64-LBGA case, memory ics is a single file. 2Gb 128M x 16 is the chip's memory size. Memory data is stored in FLASH-format, which is common in mainstream devices. A wide operating temperature range makes this device ideal for a variety of demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V volts. Its recommended mounting type is Surface Mount. 64 terminations are planted on the chip. There are 1 functions supported by this part as part of the comprehensive working process. In order to power this memory device, 3V will be necessary. The memory device is enclosed in a package with an 64-pin connector. This chip uses Surface Mount mounting, a straightforward, high-efficiency method of mounting. This memory chip is rated 60mA for its nominal supply current. In terms of power requirements, this memory chip uses only 3/3.3V . Its target applications rely heavily on the GL-S series memory devices. A programming voltage of 3V is needed to alter the state of certain nonvolatile memory arrays. Total, there are 2K specifically sized divisions within this memory.
S70GL02GS11FHI010 Features
Package / Case: 64-LBGA 64 Pins
S70GL02GS11FHI010 Applications
There are a lot of Cypress Semiconductor Corp S70GL02GS11FHI010 Memory applications.