S70GL02GS11FHI013 Overview

There is a Non-Volatile memory type associated with this device. There is a Tape & Reel (TR) case available. As you can see, it is embedded in 64-LBGA case. On the chip, there is an 2Gb 128M x 16 memory, which is the size of the chip's memory. This device uses a FLASH-format memory, which is of mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. As far as the mounting type is concerned, Surface Mount is recommended. It is planted on the chip with 64 terminations. There are 1 functions supported by this part as part of the comprehensive working process. This ic memory chip is designed to be supplied with 3V. This memory device is enclosed in a 64-pin package. This memory chip requires a mere 3/3.3V of power. This part is part of the GL-S series of memory devices, which play a key role in its target applications. A maximum supply current of 0.16mA can be used to operate this device. Nonvolatile memory arrays require 3V programming voltage to change their state. It is important to keep in mind that this memory has 2K specific sized divisions in total.

S70GL02GS11FHI013 Features

Package / Case: 64-LBGA
64 Pins

S70GL02GS11FHI013 Applications

There are a lot of Cypress Semiconductor Corp S70GL02GS11FHI013 Memory applications.

• workstations,
• networks
• Camcorders
• eDRAM
• networking
• multimedia computers
• nonvolatile BIOS memory
• graphics card
• data buffer
• telecommunications