DC-ME-01T-NS-50 datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Digi stock available on our website
SOT-23
DC-ME-01T-NS-50 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Package / Case
Module
Operating Temperature
-40°C~85°C
Packaging
Bulk
Published
2007
Series
Digi Connect ME®
Size / Dimension
0.75 x 1.44 19.1mmx36.7mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
RJ45
Frequency
55MHz
Operating Supply Voltage
3.3V
Interface
Ethernet, Serial
Operating Supply Current
270mA
RAM Size
8MB
Memory Type
FLASH, NOR, SDRAM
Core Processor
ARM7TDMI, NS7520
Data Rate
230 kbps
Power Consumption
891mW
Module/Board Type
MPU Core
Flash Size
2MB
Radiation Hardening
No
RoHS Status
RoHS Compliant
Lead Free
Lead Free
DC-ME-01T-NS-50 Product Details
DC-ME-01T-NS-50 Overview
This microcontroller has a module or board type of MPU Core, which indicates that it is a module.Microprocessor chip is powered by a processor with a total of ARM7TDMI, NS7520 cores in it.The default setting of the microcontroller is -40°C~85°C.MCU chips flash size is 2MB.The connector type RJ45 refers to the connector type.MCU chip belongs to the Digi Connect ME? Series.The RAM size has been reduced to 8MB in order to ensure that the software runs normally.In order for microprocessor to continue to function accurately, microprocessor must continue to operate exactly at 55MHz frequency as long as microprocessor remains accurate.This package comes with Module.Voltage of the operating supply this microcontrollers operates with a 3.3V volt supply.For the purpose of storing the data, we have chosen the value FLASH, NOR, SDRAM.Bulk-size packaging is available.It is important to note that the MCUs supply current is set to 270mA.
DC-ME-01T-NS-50 Features
Core processor of ARM7TDMI, NS7520 Flash size of 2MB Bulk packaging
DC-ME-01T-NS-50 Applications
There are a lot of Digi DC-ME-01T-NS-50 Microcontroller, Microprocessor, FPGA Modules applications.