Freescale Semiconductor, Inc. (NXP Semiconductors)
3.3V 32-bit Microprocessor 50MHz 3.3V BGA
SOT-23
XPC850DSLZT50BU Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
BGA
Surface Mount
YES
JESD-609 Code
e0
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Terminal Finish
TIN LEAD
Max Operating Temperature
95°C
Min Operating Temperature
0°C
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
220
Supply Voltage
3.3V
Frequency
50MHz
Time@Peak Reflow Temperature-Max (s)
30
Pin Count
256
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.465V
Power Supplies
3.3V
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Bit Size
32
Halogen Free
Not Halogen Free
Address Bus Width
26
Boundary Scan
YES
Low Power Mode
YES
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Number of Cores
1
Length
23mm
Height Seated (Max)
2.35mm
Width
23mm
RoHS Status
RoHS Compliant
Lead Free
Contains Lead
XPC850DSLZT50BU Product Details
XPC850DSLZT50BU Overview
Since the microprocessor is packed in BGA, shipping overseas is convenient. It is a MICROPROCESSOR, RISC in terms of uPs/uCs/Peripheral ICs. The total number of terminations is 256. Turning on and running the embedded microprocessor with a 3.3V voltage supply should be possible. The architecture of the microprocessor is 32-bit. A CPU operates at a frequency of 50MHz. 3.465V is its maximum supply current. There is a wide width of 32 on the external data bus of this CPU. Temperatures above 95°C should not be used with the microprocessor. Injection of 256 pins into the body of the embedded microprocessor is carried out. A 1-core CPU is used here. In the datasheet, 3.3V power supplies are required for this embedded microprocessor.
XPC850DSLZT50BU Features
32-Bit Structure 1-Core CPU
XPC850DSLZT50BU Applications
There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) XPC850DSLZT50BU Microprocessor applications.